公开(公告)号：US20010037875A1

公开(公告)日：2001-11-08

申请号：US09366153

申请日：1999-08-03

申请人： Andrea L. Mays

发明人： FRED GUERRERO

IPC分类号： F28F007/00 ,  F28D015/00 ,  F28F001/30 ,  H05K007/20

CPC分类号： H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit relation so that a plurality of the fins, when mounted on the shaft, define a plurality of air passageways and the fins and shaft efficiently transfer heat away from the semiconductor device and into the surrounding atmosphere. In an improved version of the heat sink, the heat-dissipating fins may be corrugated so as to increase the surface area of each individual fin without increasing its perimeter. A heat pipe may be used in conjunction with the core shaft or base of the heat sink so as to facilitate heat transfer away from the electronic component. An improved heat sink may also include a base having a plurality of openings and a small fan connected to the portion of the base with the openings, so as to direct air across and between adjacent fins.

摘要翻译： 一种可堆放式散热器，其具有与半导体器件热接合的芯轴和多个单独的薄片，其具有用于以压配合关系接收所述芯轴的开口，使得当安装在所述轴上时， 限定多个空气通道，翅片和轴有效地将热量从半导体器件传递到周围的大气中。 在散热器的改进形式中，散热翅片可以是波纹状的，以便增加每个散热片的表面积而不增加其周长。 热管可以与散热器的芯轴或底座结合使用，以便于远离电子部件的热传递。 改进的散热器还可以包括具有多个开口的基座和与基座的具有开口的部分连接的小风扇，以便将空气引导到相邻翅片之间和之间。