System and Method for Improved Automated Semiconductor Wafer Manufacturing
    1.
    发明申请
    System and Method for Improved Automated Semiconductor Wafer Manufacturing 有权
    改进的自动半导体晶片制造的系统和方法

    公开(公告)号:US20100185311A1

    公开(公告)日:2010-07-22

    申请号:US12617380

    申请日:2009-11-12

    IPC分类号: G06F17/50 G06G7/66

    摘要: System and method for automated semiconductor manufacturing is provided. In accordance with one aspect of the present invention, a system for automated semiconductor wafer manufacturing includes a smart overlay control (SOC) database having empirical alignment data related to overlay alignment, and a simulation module communicatively coupled to the SOC database, the simulation module determining a simulated overlay alignment of a wafer on the plurality of photolithography tools in a tool bank based on the empirical alignment data stored in the SOC database. The system also includes a dispatch module communicatively coupled to the SOC database and the simulation module, the dispatch module controlling the dispatch of a wafer to one of a plurality of photolithography tools in a tool bank based at least in part on the simulated overlay alignment.

    摘要翻译: 提供了自动半导体制造的系统和方法。 根据本发明的一个方面,一种用于自动半导体晶片制造的系统包括具有与重叠对准相关的经验对准数据的智能覆盖控制(SOC)数据库,以及通信地耦合到SOC数据库的仿真模块,模拟模块确定 基于存储在SOC数据库中的经验对准数据,在工具库中的多个光刻工具上的晶片的模拟覆盖对准。 该系统还包括通信地耦合到SOC数据库和模拟模块的调度模块,调度模块至少部分地基于模拟的覆盖对齐来控制晶片分配到工具库中的多个光刻工具中的一个。

    System and method for improved automated semiconductor wafer manufacturing
    2.
    发明授权
    System and method for improved automated semiconductor wafer manufacturing 有权
    用于改进自动化半导体晶片制造的系统和方法

    公开(公告)号:US08463419B2

    公开(公告)日:2013-06-11

    申请号:US12617380

    申请日:2009-11-12

    IPC分类号: G06F19/00

    摘要: System and method for automated semiconductor manufacturing is provided. In accordance with one aspect of the present invention, a system for automated semiconductor wafer manufacturing includes a smart overlay control (SOC) database having empirical alignment data related to overlay alignment, and a simulation module communicatively coupled to the SOC database, the simulation module determining a simulated overlay alignment of a wafer on the plurality of photolithography tools in a tool bank based on the empirical alignment data stored in the SOC database. The system also includes a dispatch module communicatively coupled to the SOC database and the simulation module, the dispatch module controlling the dispatch of a wafer to one of a plurality of photolithography tools in a tool bank based at least in part on the simulated overlay alignment.

    摘要翻译: 提供了自动半导体制造的系统和方法。 根据本发明的一个方面,一种用于自动半导体晶片制造的系统包括具有与重叠对准相关的经验对准数据的智能覆盖控制(SOC)数据库,以及通信地耦合到SOC数据库的仿真模块,模拟模块确定 基于存储在SOC数据库中的经验对准数据,在工具库中的多个光刻工具上的晶片的模拟覆盖对准。 该系统还包括通信地耦合到SOC数据库和模拟模块的调度模块,该调度模块至少部分地基于模拟的重叠对齐来控制将晶片分配到工具库中的多个光刻工具中的一个。