公开(公告)号：US06574695B1

公开(公告)日：2003-06-03

申请号：US09478929

申请日：2000-01-06

Applicant: James Mott ,  Arvind Kini ,  David Redman ,  Nancy Lee ,  Ashish Munjal

Inventor： James Mott ,  Arvind Kini ,  David Redman ,  Nancy Lee ,  Ashish Munjal

IPC: G06F1300

CPC classification number: G06F13/4027 ,  G06F13/4081

Abstract: A system and method for providing hot swap capability with minimal changes in a system which uses existing circuitry and drivers. In one embodiment, a computer system has a host processor and a hot-swap-capable device, each coupled to a Compact PCI bus. The device includes one or more pre-existing circuits (ASICs and/or standard off-the-shelf circuits) and corresponding pre-existing drivers. A hot-swap-capable bus bridge is interposed between the circuits and the Compact PCI bus to provide hot swap functionality while allowing the pre-existing circuits and drivers to be used without modification. In one embodiment, an Intel 21554 is used as the hot-swap-capable bus bridge. The 21554 is programmed to emulate a transparent bridge. Modified drivers in the OBP firmware and OS software allow the system to recognize the 21554 in this transparent configuration and to probe the secondary side of the 21554 for the circuits.

Abstract translation: 一种提供热插拔功能的系统和方法，该系统和方法使用现有的电路和驱动器的系统中的最小变化。 在一个实施例中，计算机系统具有主机处理器和热插拔功能设备，每个耦合到紧凑PCI总线。 该设备包括一个或多个预先存在的电路（ASIC和/或标准现成电路）和相应的预先存在的驱动器。 电路和Compact PCI总线之间插有热插拔总线桥，以提供热插拔功能，同时允许使用预先存在的电路和驱动器，无需修改。 在一个实施例中，使用Intel 21554作为热插拔总线桥。 21554被编程为模拟一个透明的桥。 OBP固件和OS软件中的修改驱动程序允许系统识别这种透明配置中的21554，并探测21554的二次侧电路。