摘要:
A voltage-mode driver circuit supporting pre-emphasis is implemented to include a driver arm and a correction arm. The driver arm receives an input signal, and is operable, in pre-emphasis intervals as well as steady-state intervals, to connect a first impedance between an output terminal of the driver circuit and a constant reference potential. The correction arm is operable to connect a correction impedance in parallel with the first impedance in pre-emphasis intervals, and to decouple the correction impedance from the first impedance in steady-state intervals. The parallel connection of the first impedance and the correction impedance in pre-emphasis intervals increases the voltage level of the output signal of the driver circuit in pre-emphasis intervals. The use of the correction arm compensates for the effect of parasitic capacitance at one or more nodes of the driver circuit, thereby reducing the settling time of the output signal and enabling high-speed operation.
摘要:
A voltage-mode driver circuit supporting pre-emphasis is implemented to include a driver arm and a correction arm. The driver arm receives an input signal, and is operable, in pre-emphasis intervals as well as steady-state intervals, to connect a first impedance between an output terminal of the driver circuit and a constant reference potential. The correction arm is operable to connect a correction impedance in parallel with the first impedance in pre-emphasis intervals, and to decouple the correction impedance from the first impedance in steady-state intervals. The parallel connection of the first impedance and the correction impedance in pre-emphasis intervals increases the voltage level of the output signal of the driver circuit in pre-emphasis intervals. The use of the correction arm compensates for the effect of parasitic capacitance at one or more nodes of the driver circuit, thereby reducing the settling time of the output signal and enabling high-speed operation.
摘要:
A method of forming an electrically conductive via that abuts a key hole formed in filler material. A void is etched through the filler material in which the key hole is formed, thereby forming a link between the void and the key hole. A liner is formed within the void, where the liner is formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the link between the void and the key hole and thereby trap any contaminants within the key hole. Electrically conductive via material is deposited within the void to form the via.