公开(公告)号：US4434022A

公开(公告)日：1984-02-28

申请号：US512047

申请日：1983-07-08

申请人： Osao Kamada ,  Yoshiaki Matsuga ,  Masami Watase ,  Tadato Kudo ,  Hiroyoshi Harada ,  Atsushi Kanezaki

发明人： Osao Kamada ,  Yoshiaki Matsuga ,  Masami Watase ,  Tadato Kudo ,  Hiroyoshi Harada ,  Atsushi Kanezaki

IPC分类号： B32B15/08 ,  B32B38/00 ,  C25F3/02 ,  C25F7/00 ,  H05K3/07 ,  H05K3/38 ,  C23F1/00 ,  B44C1/22 ,  C03C15/00

CPC分类号： H05K3/383 ,  H05K2201/0355 ,  H05K3/07 ,  H05K3/386

摘要： A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material comprising, introducing a rolled copper foil through a power supply/guide roller into an electrolyte so as to pass between two parallel electrodes which are disposed in the electrolyte. An AC, DC or a combination thereof is supplied to the power supply/guide roller and the electrodes to form an etched layer on either one or both sides of the rolled copper foil. An adhesive is applied to the etched layer and the resultant rolled copper foil is pressed with a substrate made of a synthetic resin put together to form a laminate.

摘要翻译： 一种制造覆铜层压板的方法，其包括：作为电路导电材料的卷绕的铜箔，其包括：通过电源/引导辊将卷绕的铜箔引入电解质中，以便在布置在 电解液 将AC，DC或其组合提供给电源/引导辊和电极，以在轧制的铜箔的一侧或两侧上形成蚀刻层。 将粘合剂施加到蚀刻层，并将所得到的轧制铜箔用合成树脂制成的基板压制在一起形成层压体。