公开(公告)号：US07417823B2

公开(公告)日：2008-08-26

申请号：US11073952

申请日：2005-03-07

申请人： BengSee Lim ,  WaiOnn Chee ,  PeiKoh Lee ,  Jimmy TzeMing Pang ,  BoonSeng Ong ,  Niroot Jierapipatanakul

发明人： BengSee Lim ,  WaiOnn Chee ,  PeiKoh Lee ,  Jimmy TzeMing Pang ,  BoonSeng Ong ,  Niroot Jierapipatanakul

IPC分类号： G11B33/10 ,  G11B33/12 ,  G11B25/04

CPC分类号： G11B33/121 ,  G11B5/5582 ,  G11B5/59694 ,  G11B25/043 ,  G11B33/08

摘要： An apparatus and method for mounting a shock sensor to the printed circuit board (PCB) of a disc drive are provided. In particular, the present invention allows the shock sensor to be mounted at any location on the printed circuit board rather than being limited to placement adjacent a mounting screw. The present invention includes a clamping mechanism for rigidly clamping the PCB to the head disc assembly (HDA) so that any shock is properly transmitted from the HDA to the PCB and then to the shock sensor. In one exemplary embodiment, the PCB is clamped between a shield and the HDA. The shock sensor is then position near the point at which the PCB is clamped so that the point of clamping provides transmission of any shock in the Z-axis to the shock sensor. Shocks in the X-Y axis direction are transmitted via the normal mounting screws.

摘要翻译： 提供了一种用于将冲击传感器安装到盘驱动器的印刷电路板（PCB）的装置和方法。 特别地，本发明允许将冲击传感器安装在印刷电路板上的任何位置，而不是限于邻近安装螺钉放置。 本发明包括用于将PCB刚性地夹紧到头盘组件（HDA）的夹紧机构，使得任何冲击从HDA适当地传递到PCB，然后到达冲击传感器。 在一个示例性实施例中，PCB夹在屏蔽件和HDA之间。 然后，冲击传感器位于靠近PCB夹紧点的位置，因此夹紧点可将Z轴上的任何冲击传递给震动传感器。 X-Y轴方向的冲击通过普通的安装螺丝传递。

公开(公告)号：US20060198045A1

公开(公告)日：2006-09-07

申请号：US11073952

申请日：2005-03-07

申请人： BengSee Lim ,  WaiOnn Chee ,  PeiKoh Lee ,  Jimmy Pang ,  BoonSeng Ong ,  Niroot Jierapipatanakul

发明人： BengSee Lim ,  WaiOnn Chee ,  PeiKoh Lee ,  Jimmy Pang ,  BoonSeng Ong ,  Niroot Jierapipatanakul

IPC分类号： G11B17/00

CPC分类号： G11B33/121 ,  G11B5/5582 ,  G11B5/59694 ,  G11B25/043 ,  G11B33/08

摘要： An apparatus and method for mounting a shock sensor to the printed circuit board (PCB) of a disc drive are provided. In particular, the present invention allows the shock sensor to be mounted at any location on the printed circuit board rather than being limited to placement adjacent a mounting screw. The present invention includes a clamping mechanism for rigidly clamping the PCB to the head disc assembly (HDA) so that any shock is properly transmitted from the HDA to the PCB and then to the shock sensor. In one exemplary embodiment, the PCB is clamped between a shield and the HDA. The shock sensor is then position near the point at which the PCB is clamped so that the point of clamping provides transmission of any shock in the Z-axis to the shock sensor. Shocks in the X-Y axis direction are transmitted via the normal mounting screws.

摘要翻译： 提供了一种用于将冲击传感器安装到盘驱动器的印刷电路板（PCB）的装置和方法。 特别地，本发明允许将冲击传感器安装在印刷电路板上的任何位置，而不是限于邻近安装螺钉放置。 本发明包括用于将PCB刚性地夹紧到头盘组件（HDA）的夹紧机构，使得任何冲击从HDA适当地传递到PCB，然后到达冲击传感器。 在一个示例性实施例中，PCB夹在屏蔽件和HDA之间。 然后，冲击传感器位于靠近PCB夹紧点的位置，因此夹紧点可将Z轴上的任何冲击传递给震动传感器。 X-Y轴方向的冲击通过普通的安装螺丝传递。

公开(公告)号：US06317285B1

公开(公告)日：2001-11-13

申请号：US09697002

申请日：2000-10-26

申请人： Qiang Bi ,  Kevin Arthur Gomez ,  Jimmy Tze Ming Pang ,  Stephen Kow Chiew Kuan ,  MengEng Lye ,  BengSee Lim

发明人： Qiang Bi ,  Kevin Arthur Gomez ,  Jimmy Tze Ming Pang ,  Stephen Kow Chiew Kuan ,  MengEng Lye ,  BengSee Lim

IPC分类号： G11B5455

CPC分类号： G11B5/59683 ,  G11B5/012 ,  G11B5/5534 ,  G11B5/59644 ,  G11B7/0945

摘要： A method of calibrating magnetoresistive (MR) head geometry for a product head in a selfservo writing disc drive includes the steps of writing a first burst at an inner diameter of a disc surface using the write head of the product head. Next, the first burst is read using the MR read head of the product head, and a first read amplitude of the first burst is determined. From the first read amplitude of the first burst, it is determined which one of a multiple different sets of subsequent inner diameter steps to perform. Then, the one of the multiple different sets of subsequent inner diameter steps is performed to determine a read head width, a write head width, and a read-write offset between the read head and the write head.

摘要翻译： 在自写入盘驱动器中用于校准磁头（MR）头几何形状的方法包括以下步骤：使用产品头的写入头在盘表面的内径处写入第一脉冲串。 接下来，使用产品头的MR读取头读取第一个突发，并确定第一个突发的第一个读取幅度。 从第一脉冲串的第一读取幅度开始，确定执行多个不同组的后续内径步骤中的哪一个。 然后，执行多个不同组的后续内径步骤中的一个，以确定读头和写头之间的读头宽度，写头宽度和读 - 写偏移。