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公开(公告)号：US20120195344A1
公开(公告)日：2012-08-02
申请号：US13364945
申请日：2012-02-02
CPC分类号： G01K1/08 , G01K1/18 , G01K7/18 , Y10T29/49117 , Y10T29/49826
摘要： The present subject matter relates generally to temperature sensors using one or a plurality of temperature sensing devices. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a temperature sensing device housed in the enclosure. A thermally conductive material connects a surface of the temperature sensing device directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the temperature sensing device. In various embodiments, the temperature sensing device is a resistance temperature detector (RTD).
摘要翻译： 本主题大体上涉及使用一个或多个温度感测装置的温度传感器。 本主题的各种实施例包括温度传感器组件。 温度传感器组件包括具有内表面和容纳在外壳中的温度感测装置的外壳。 导热材料将温度感测装置的表面以侧面安装的方式直接连接到外壳的内表面，以提供从外壳到温度感测装置的快速热传导。 在各种实施例中，温度感测装置是电阻温度检测器（RTD）。
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公开(公告)号：US20110026562A1
公开(公告)日：2011-02-03
申请号：US12847815
申请日：2010-07-30
CPC分类号： G01K7/18 , G01K1/08 , Y10T29/49002
摘要： The present subject matter relates generally to temperature sensors using a thin film element. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a thin film element housed in the enclosure. A thermally conductive material connects a surface of the thin film element directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the thin film element. In various embodiments, the thin film element is a resistance temperature detector (RTD).
摘要翻译： 本主题大体上涉及使用薄膜元件的温度传感器。 本主题的各种实施例包括温度传感器组件。 温度传感器组件包括具有内表面和容纳在外壳中的薄膜元件的外壳。 导热材料以侧面安装的方式将薄膜元件的表面直接连接到外壳的内表面，以提供从外壳到薄膜元件的快速热传导。 在各种实施例中，薄膜元件是电阻温度检测器（RTD）。
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