公开(公告)号：US20230200371A1

公开(公告)日：2023-06-29

申请号：US18081570

申请日：2022-12-14

申请人： Bruno A. Nardelli

发明人： Bruno A. Nardelli

IPC分类号： A01M23/24

CPC分类号： A01M23/245

摘要： An anti-torsion system and kit for spring-powered rodent traps. The system and kit make use of one or more torsion-blockers. Each torsion-blocker includes a substrate having a first surface and a second surface opposite the first surface, a first fastening mechanism on the first surface of the substrate attaching the torsion-blocker to the base of the rodent trap, and a second fastening mechanism on the second surface of the substrate attaching the torsion-blocker to a surface upon which the rodent trap base rests. When a rodent trap is mounted using the system, the one or more torsion-blockers oppose the torsion force and prevents the twisting movement of the rodent trap base caused by the acceleration and snapping down of the hammer motivated by the spring from occurring.

公开(公告)号：US20110315195A1

公开(公告)日：2011-12-29

申请号：US13037214

申请日：2011-02-28

申请人： Eric L. Brown ,  Robert S. DiMatteo ,  Bruno A. Nardelli ,  Bin Peng ,  Xiao Li

发明人： Eric L. Brown ,  Robert S. DiMatteo ,  Bruno A. Nardelli ,  Bin Peng ,  Xiao Li

IPC分类号： H01L31/052

CPC分类号： H01L31/0406 ,  H01L31/024 ,  H01L31/052 ,  H01L31/0521 ,  H02S10/30 ,  Y02E10/50

摘要： The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.

摘要翻译： 本发明涉及用于固态转换热量的微间隙热光伏（MTPV）技术。 问题是形成并且然后保持两个物体之间的亚微米间隙处的紧密间隔，以便保持增强的性能。 虽然可以获得亚微米间隙，但热和冷表面的热效应引起元件的拔罐，弯曲或变形，导致间隙间隔的变化，从而导致功率输出的不可控变化。 该设计的主要方面是允许发射器芯片与壳体内表面紧密接触，从而具有良好的热传递。 将光伏电池向外压靠在发射器芯片上，以便将它们压靠在内壁上。 高温热界面材料改善了壳体内表面和发射极芯片之间的热传递。

公开(公告)号：US08791357B2

公开(公告)日：2014-07-29

申请号：US13037214

申请日：2011-02-28

申请人： Eric L. Brown ,  Robert S. DiMatteo ,  Bruno A. Nardelli ,  Bin Peng ,  Xiao Li

发明人： Eric L. Brown ,  Robert S. DiMatteo ,  Bruno A. Nardelli ,  Bin Peng ,  Xiao Li

IPC分类号： H01L31/00 ,  H01L31/04 ,  H01L31/024

CPC分类号： H01L31/0406 ,  H01L31/024 ,  H01L31/052 ,  H01L31/0521 ,  H02S10/30 ,  Y02E10/50

摘要： The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.

摘要翻译： 本发明涉及用于固态转换热量的微间隙热光伏（MTPV）技术。 问题是形成并且然后保持两个物体之间的亚微米间隙处的紧密间隔，以便保持增强的性能。 虽然可以获得亚微米间隙，但热和冷表面的热效应引起元件的拔罐，弯曲或变形，导致间隙间距的变化，从而导致功率输出的不可控变化。 该设计的主要方面是允许发射器芯片与壳体内表面紧密接触，从而具有良好的热传递。 将光伏电池向外压靠在发射器芯片上，以便将它们压靠在内壁上。 高温热界面材料改善了壳体内表面和发射极芯片之间的热传递。