公开(公告)号：US20130240254A1

公开(公告)日：2013-09-19

申请号：US13563861

申请日：2012-08-01

Applicant: XIAO-ZHAN PENG ,  QIANG NIE ,  CUI-CUI ZHANG ,  JUN-CUI ZHANG

Inventor： XIAO-ZHAN PENG ,  QIANG NIE ,  CUI-CUI ZHANG ,  JUN-CUI ZHANG

IPC: H05K1/09 ,  H05K3/00

CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/0969 ,  H05K2201/09881 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124

Abstract: A printed circuit board includes a substrate, at least one pad on the substrate, and permanent mold coatings capable of coating on the copper foil. Each pad includes a copper foil and a solder resist coating on the substrate and surrounding the copper foil. The copper foil defines an opening. The opening is coated with solder resist, whereby the permanent mold coatings form a recess corresponding to the opening when coated on the copper foil. A method for manufacturing a printed circuit board is also provided.

Abstract translation: 印刷电路板包括基板，基板上的至少一个焊盘以及能够涂覆在铜箔上的永久模具涂层。 每个焊盘在基板上包括铜箔和阻焊剂涂层，并且围绕铜箔。 铜箔限定开口。 开口涂有阻焊剂，由此当涂覆在铜箔上时，永久模具涂层形成对应于开口的凹部。 还提供了制造印刷电路板的方法。