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公开(公告)号:US20050238906A1
公开(公告)日:2005-10-27
申请号:US11167277
申请日:2005-06-28
CPC分类号: C23C2/04 , C23C2/08 , H05K3/3463 , H05K3/3473 , H05K2203/073 , Y10S428/936 , Y10T428/12493 , Y10T428/12528 , Y10T428/12708
摘要: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.
摘要翻译: 将第一金属通过将基底浸入包含第一金属和有机稀释剂的化合物的浴中而被镀在包含第二金属的基材上。 第二种金属比第一种金属更具有正电性。 在第一和第二金属的相图中,有机稀释剂的沸点高于共晶点。 该浴液在共晶点以上运行,但低于第二种金属的熔点。 例如,将铋浸渍在无铅锡基焊球上,随后通过无助焊回流重新分布。 还提供镀层结构。