公开(公告)号：US20100044015A1

公开(公告)日：2010-02-25

申请号：US12514176

申请日：2007-11-01

申请人： Cesare Capriz ,  Ugo Barucca

发明人： Cesare Capriz ,  Ugo Barucca

IPC分类号： F28D15/00

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).

摘要翻译： 一种用于电子部件的流体冷却散热器（1），其具有可与至少一个电子部件（3）相关联的热交换器（2），所述热交换器具有至少一个具有入口（7）的通道（6） 和用于冷却流体的出口（8）。 热交换器（2）具有用于与电子部件（3）接触的第一外表面（4）和第二外表面（5）。 散热器（1）具有在第二外表面（5）处在热交换器（2）上操作的加强元件（15），用于将热交换器（2）与电子部件（3）相关联并按压。

公开(公告)号：US08616267B2

公开(公告)日：2013-12-31

申请号：US12514176

申请日：2007-11-01

申请人： Cesare Capriz ,  Ugo Barucca

发明人： Cesare Capriz ,  Ugo Barucca

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).

摘要翻译： 一种用于电子部件的流体冷却散热器（1），其具有可与至少一个电子部件（3）相关联的热交换器（2），所述热交换器具有至少一个具有入口（7）的通道（6） 和用于冷却流体的出口（8）。 热交换器（2）具有用于与电子部件（3）接触的第一外表面（4）和第二外表面（5）。 散热器（1）具有在第二外表面（5）处在热交换器（2）上操作的加强元件（15），用于将热交换器（2）与电子部件（3）相关联并按压。

公开(公告)号：US06747865B2

公开(公告)日：2004-06-08

申请号：US10121177

申请日：2002-04-12

申请人： Cesare Capriz ,  Ashok Patel

发明人： Cesare Capriz ,  Ashok Patel

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.

摘要翻译： 一种用于电子部件的散热器，具有连接至少一个电子部件的散热器和设计成向散热器供应空气的通风机。 散热器包括连接到电子部件并具有多个开口的至少一个导热板。

公开(公告)号：US06661658B2

公开(公告)日：2003-12-09

申请号：US10121337

申请日：2002-04-12

申请人： Cesare Capriz ,  Luca Rossi

发明人： Cesare Capriz ,  Luca Rossi

IPC分类号： H05K720

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joined to the first plate. The first face of the second plate has a groove formed therein for accommodating a cooling liquid. The first face and the second face of the second plate are parallel at least along the length of the groove.

公开(公告)号：US5991151A

公开(公告)日：1999-11-23

申请号：US081623

申请日：1998-05-19

申请人： Cesare Capriz

发明人： Cesare Capriz

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002

摘要： A heat sink (2) for electronic components (1) comprises: a base portion (3) fitted with device (4) for coupling with a fixed support plane (5) of an apparatus; a plane surface (6), positioned in proximity to the base portion (3), in contact with a corresponding surface (7) of the electronic component (1), and an additional heat dissipation portion (8) comprising a prolongation (9) of the base portion (3) from which extend a plurality of fins (10); an elastically yielding element (11) acts between the heat sink (2) and the electronic component (1) to obtain a stable positioning of the surface (7) of the component itself to the related plane surface (6) of the heat sink (2); a pair of fins (10a, 10b), contiguous to each other, presents a respective inner wall (12, 13), sush walls being opposite one to the other and so shaped as to define a compartment (14) for stably housing a portion (15) of the elastically yielding element (11).

摘要翻译： 一种用于电子部件（1）的散热器（2），包括：一个装有装置（4）的基座部分（3），用于与设备的固定支撑平面（5）连接; 位于所述基部（3）附近的与所述电子部件（1）的对应表面（7）接触的平面（6）和包括延伸部（9）的附加散热部分（8） 的基部（3）延伸多个翅片（10）; 弹性屈服元件（11）作用在散热器（2）和电子部件（1）之间，以便将部件本身的表面（7）稳定地定位到散热器的相关平面（6） 2）; 彼此相邻的一对翅片（10a，10b）呈现相应的内壁（12,13），所述凹壁相对于另一个形成为形成为限定用于稳定地容纳部分 （11）的弹性屈服元件（15）。