公开(公告)号：US20100075026A1

公开(公告)日：2010-03-25

申请号：US12289542

申请日：2008-10-30

Applicant: Yuh Sung ,  Ming-Der Ger ,  Chang-Pin Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

Inventor： Yuh Sung ,  Ming-Der Ger ,  Chang-Pin Chang ,  Chun-Chieh Tseng ,  Wen-Ding Chen

IPC: C08K3/08 ,  B05D3/10 ,  H01C17/00

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/168 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C23C18/38 ,  H05K3/422 ,  H05K2203/0709

Abstract: A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.

Abstract translation: 在本发明中公开了由烯属不饱和单体和亲水性单体形成的催化金属颗粒的共聚物，催化金属是Au，Ag，Pd，Pt或Ru。 当温度低于特定温度时，共聚物是亲水性的，当温度大于特定温度时，共聚物变得疏水。 本发明还公开了一种通过化学镀在基板上形成金属层的方法，该方法包括使基材与油墨组合物接触，干燥基材上的油墨组合物，以及使干燥的油墨组合物与化学镀溶液接触，其中 油墨组合物含有本发明的水相共聚物。 本发明还公开了一种用于在基板的通孔中形成金属导体的方法。