公开(公告)号：US20240360331A1

公开(公告)日：2024-10-31

申请号：US18770498

申请日：2024-07-11

Applicant: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE

Inventor： Seung Kwon SEOL ,  Sang Hyeon LEE ,  Won Suk CHANG ,  Jae Yeon PYO

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/14 ,  C09D11/322 ,  C09D11/38 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/14 ,  C09D11/322 ,  C09D11/38 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/2066 ,  H05K3/182

Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

公开(公告)号：US20230313382A1

公开(公告)日：2023-10-05

申请号：US17754502

申请日：2020-10-02

Applicant: MacDermid, Inc.

Inventor： Trevor PEARSON ,  Alison HYSLOP ,  Amrik SINGH ,  Roderick HERDMAN

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/38

CPC classification number: C23C18/163 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/1879 ,  C23C18/32 ,  C23C18/38

Abstract: A support for supporting a component to be plated in a chromic acid-free plating process, the support having a contact surface comprising iodine-treated and/or bromine-treated plastic.

公开(公告)号：US11668008B2

公开(公告)日：2023-06-06

申请号：US17111040

申请日：2020-12-03

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe

IPC: B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  H01L23/498 ,  H01L33/62 ,  H01L23/14 ,  H01L25/075 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/30 ,  C23F1/02

CPC classification number: C23C18/1641 ,  B32B3/30 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/36 ,  C23C18/161 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H01L23/52 ,  H01L27/156 ,  B32B2307/412 ,  B32B2457/20 ,  C23F1/02 ,  H01L23/145 ,  H01L23/498 ,  H01L25/0753 ,  H01L33/62

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20180258307A1

公开(公告)日：2018-09-13

申请号：US15456868

申请日：2017-03-13

Applicant: Eastman Kodak Company

Inventor： Deepak Shukla ,  Kevin M. Donovan

IPC: C09D101/12 ,  C09D5/24 ,  C09D7/12 ,  C09D11/38 ,  C09D11/03 ,  C09D11/14 ,  C23C18/38

CPC classification number: C09D101/12 ,  C08K3/04 ,  C08K2003/0806 ,  C08K2201/005 ,  C08K2201/011 ,  C09D5/24 ,  C09D7/67 ,  C09D7/68 ,  C09D11/033 ,  C09D11/037 ,  C09D11/14 ,  C09D11/322 ,  C09D11/324 ,  C09D11/36 ,  C09D11/38 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2053 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  C08K3/08

Abstract: An article has a substrate and a pattern of a dry silver nanoparticle-containing composition comprising at least 20 weight % of one or more (a) polymers, that are cellulosic polymers; (d) silver nanoparticles having a mean particle size of 25-750 nm and present in an amount of 0.1-400 weight %, based on the total weight of the one or more (a) polymers; and (e) carbon black in an amount of 5-50 weight %, based on the total weight of the one or more (a) polymers. Such patterns can have multiple fine lines of any geometric arrangement. The article can have multiple patterns of this type, and each pattern can be electrolessly plated with a suitable metal such as copper to provide electrically-conductive product articles.

公开(公告)号：US09889471B2

公开(公告)日：2018-02-13

申请号：US14533126

申请日：2014-11-05

Applicant: Cuptronic Technology Ltd.

Inventor： Sven Göthe ,  Björn Atthoff

IPC: B05D7/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/18 ,  B05D3/06 ,  B05D5/00 ,  C08J7/04

CPC classification number: B05D7/548 ,  B05D3/06 ,  B05D5/00 ,  C08J7/045 ,  C08J2355/02 ,  C08J2369/00 ,  C08J2433/02 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1844 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  Y10T428/24355

Abstract: A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

公开(公告)号：US20180015697A1

公开(公告)日：2018-01-18

申请号：US15716653

申请日：2017-09-27

Applicant: FUJIFILM CORPORATION

Inventor： Takahiko ICHIKI

IPC: B32B15/08 ,  C23C18/18 ,  C08F220/56 ,  C25D5/56 ,  C08F2/44

CPC classification number: B32B15/08 ,  C08F2/44 ,  C08F220/56 ,  C08F265/06 ,  C09D4/06 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/206 ,  C23C18/30 ,  C25D5/56 ,  H05K3/185 ,  H05K2203/0713 ,  C08F222/385

Abstract: Provided are a composition for forming a plating layer, which is capable of forming a metal layer having excellent conductivity by means of a plating treatment and is capable of forming a plating layer having excellent adhesiveness to the metal layer, as well as a film having a plating layer precursor layer, a film having a plating layer, a conductive film, and a touch panel, each of which uses the composition for forming a plating layer.The composition for forming a plating layer according to the present invention includes a non-polymerizable polymer having a group capable of interacting with a metal ion, a polyfunctional monomer having two or more polymerizable functional groups, a monofunctional monomer, and a polymerization initiator.

公开(公告)号：US20170367182A1

公开(公告)日：2017-12-21

申请号：US15535087

申请日：2015-12-08

Applicant: SABIC Global Technologies B.V.

Inventor： Tong WU ,  Wei FENG ,  Yangang YAN ,  Wenjia Zhang ,  Yuxian AN ,  Xueming Lian ,  Mahari TJAHJADI

IPC: H05K1/03 ,  C08K9/02 ,  C08K5/00 ,  C08K3/22 ,  B32B27/36 ,  H05K3/18 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B27/20 ,  B32B27/32 ,  B32B27/36 ,  C08F220/16 ,  C08K3/2279 ,  C08K5/0041 ,  C08K9/02 ,  C09D4/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/38 ,  G03F7/0043 ,  H05K3/185

Abstract: The present disclosure relates to LDS materials comprising a first coating layer comprising a first LDS additive, and a base substrate, wherein the coating layer contacts the base substrate. Articles formed from the LDS materials are also disclosed that include a conductive path and a metal layer deposited on the activated path. Methods for making the LDS materials and corresponding articles are also described.

公开(公告)号：US09777380B2

公开(公告)日：2017-10-03

申请号：US15202936

申请日：2016-07-06

Applicant: Board of Regents, The University of Texas System

Inventor： Eric MacDonald ,  David Espalin ,  Ryan Wicker

IPC: H05K1/11 ,  C23C18/16 ,  B29C67/00 ,  H05K3/10 ,  H05K3/42 ,  B29L31/34

CPC classification number: C23C18/1641 ,  B29C64/00 ,  B29K2995/0006 ,  B29L2031/3425 ,  B33Y80/00 ,  C23C18/1608 ,  C23C18/1612 ,  H05K3/105 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2203/072 ,  H05K2203/0759 ,  H05K2203/107

Abstract: A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.

公开(公告)号：US20170243762A1

公开(公告)日：2017-08-24

申请号：US15588500

申请日：2017-05-05

Applicant: Intel Corporation

Inventor： Yonggang Yong LI ,  Aritra DHAR ,  Dilan SENEVIRATNE ,  Jon M. WILLIAMS

IPC: H01L21/48 ,  C23C18/38 ,  C23C18/16 ,  H01L21/288 ,  H01L23/498

CPC classification number: H01L21/4857 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  H01L21/288 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0032 ,  H05K3/045 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107

Abstract: Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

公开(公告)号：US20170208685A1

公开(公告)日：2017-07-20

申请号：US15477667

申请日：2017-04-03

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

Inventor： Bernardus Antonius Gerardus SCHRAUWEN

IPC: H05K1/03 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H01Q1/36 ,  H05K3/00 ,  H05K3/10 ,  C08K3/22 ,  C23C18/38

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.