公开(公告)号：US20240246317A1

公开(公告)日：2024-07-25

申请号：US18585500

申请日：2024-02-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Luigi COLOMBO ,  Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL

IPC分类号： B32B9/00 ,  B32B9/04 ,  B82Y30/00 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00

CPC分类号： B32B9/007 ,  B32B9/041 ,  B32B9/045 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00 ,  B32B2305/38 ,  B32B2457/14 ,  B82Y30/00 ,  C01P2002/20 ,  Y10T428/30

摘要： A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.

公开(公告)号：US20240198634A1

公开(公告)日：2024-06-20

申请号：US18285538

申请日：2022-03-03

申请人： DIC Corporation

发明人： Takamichi Aoki ,  Tomomichi Kanda

IPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/20 ,  C08K3/26 ,  C08L23/06 ,  C08L23/08 ,  C08L81/02 ,  C23C18/24 ,  C23C18/38 ,  H05K9/00

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/20 ,  C08K3/26 ,  C08L23/06 ,  C08L23/0815 ,  C08L81/02 ,  C23C18/24 ,  C23C18/38 ,  H05K9/0084 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/212 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2323/04 ,  B32B2391/00 ,  B32B2457/00 ,  C08K2003/265 ,  C08L2207/04

摘要： Provided is a method for manufacturing an electromagnetic wave-shielding member that is a laminated body having a plating layer formed on a surface of a polyarylene sulfide (PAS) molded product. Provided are an electromagnetic wave-shielding member and a method for manufacturing the electromagnetic wave-shielding member including a step of roughening a surface of a molded product obtained by molding a PAS resin composition by a chemical etching treatment, and a step of subjecting the roughened surface of the molded product to a plating treatment, wherein the laminated body has a plating layer on at least two surfaces that are paired, and the PAS resin composition is obtained by mixing a PAS resin (A), a thermoplastic resin (B) other than the polyarylene sulfide resin selected from the group consisting of a thermoplastic elastomer (b1) and a hydrolyzable thermoplastic resin (b2), a carbonate (C), and a polyolefin wax (D).

公开(公告)号：US11993851B2

公开(公告)日：2024-05-28

申请号：US16965683

申请日：2019-01-23

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Tomoko Fujii ,  Kazuhiko Ikeda ,  Shun Fukazawa

IPC分类号： C23C18/38 ,  B29C45/14 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  C09D167/02 ,  C09D177/00 ,  C09D181/02 ,  C23F1/02 ,  C23F1/14 ,  B29K705/02

CPC分类号： C23C18/38 ,  B29C45/14311 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/286 ,  B32B27/34 ,  B32B27/36 ,  C09D167/02 ,  C09D177/00 ,  C09D181/02 ,  C23F1/02 ,  C23F1/14 ,  B29K2705/02 ,  B32B2250/02 ,  B32B2262/101 ,  B32B2307/538 ,  B32B2307/54 ,  B32B2605/08 ,  B32B2605/18

摘要： An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

公开(公告)号：US11876030B2

公开(公告)日：2024-01-16

申请号：US16771730

申请日：2018-12-03

申请人： Dowa Holdings Co., Ltd. ,  The Goodsystem Corporation

发明人： Tomotsugu Aoyama ,  Hiroto Narieda ,  Ilho Kim ,  Meoung whan Cho

IPC分类号： C22C27/04 ,  B32B5/16 ,  B32B15/16 ,  B32B15/20 ,  H01L23/373 ,  C22C9/00 ,  C23C18/38 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L23/3735 ,  B32B5/16 ,  B32B15/16 ,  B32B15/20 ,  C22C9/00 ,  C22C27/04 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2264/108 ,  B32B2264/403 ,  C23C18/38 ,  H01L21/4882 ,  H01L23/562

摘要： There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.

公开(公告)号：US20230313382A1

公开(公告)日：2023-10-05

申请号：US17754502

申请日：2020-10-02

申请人： MacDermid, Inc.

发明人： Trevor PEARSON ,  Alison HYSLOP ,  Amrik SINGH ,  Roderick HERDMAN

IPC分类号： C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/38

CPC分类号： C23C18/163 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/1879 ,  C23C18/32 ,  C23C18/38

摘要： A support for supporting a component to be plated in a chromic acid-free plating process, the support having a contact surface comprising iodine-treated and/or bromine-treated plastic.

公开(公告)号：US11761091B2

公开(公告)日：2023-09-19

申请号：US16651768

申请日：2018-09-28

申请人： SRG GLOBAL LIRIA, S.L. ,  AVANZARE INNOVACION TECNOLOGICA S.L.

发明人： Urko Martin ,  Miguel Ventura ,  Manuel Pastor ,  Rebeca Negron Canovas ,  Julio Gomez Cordon ,  Luis Otano Jiminez ,  Javier Perez Martinez

IPC分类号： C23C18/30 ,  C23C18/12 ,  C23C18/28 ,  C23C18/32 ,  C23C18/38 ,  C23C18/24 ,  C23C18/20 ,  C23C18/16 ,  C25D3/38 ,  C25D5/56 ,  C09K13/10

CPC分类号： C23C18/24 ,  C09K13/10 ,  C23C18/122 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  C25D3/38 ,  C25D5/56 ,  C09K2211/183 ,  C23C18/32 ,  C23C18/38 ,  C23C2222/10

摘要： An aqueous composition for use in activating surface of polymers.

公开(公告)号：US11668008B2

公开(公告)日：2023-06-06

申请号：US17111040

申请日：2020-12-03

申请人： TDK CORPORATION

发明人： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe

IPC分类号： B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  H01L23/498 ,  H01L33/62 ,  H01L23/14 ,  H01L25/075 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/30 ,  C23F1/02

CPC分类号： C23C18/1641 ,  B32B3/30 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/36 ,  C23C18/161 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H01L23/52 ,  H01L27/156 ,  B32B2307/412 ,  B32B2457/20 ,  C23F1/02 ,  H01L23/145 ,  H01L23/498 ,  H01L25/0753 ,  H01L33/62

摘要： A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20190211455A1

公开(公告)日：2019-07-11

申请号：US16298028

申请日：2019-03-11

申请人： OrelTech Ltd.

发明人： Natalia ZAMOSHCHIK ,  Konstantin LIVANOV ,  Leonid KOZLOV ,  Yana SHEYNIN

IPC分类号： C23C18/42 ,  C23C18/16

CPC分类号： C23C18/42 ,  C23C18/14 ,  C23C18/1667 ,  C23C18/1682 ,  C23C18/32 ,  C23C18/38

摘要： A method for forming a metal active component in a hybrid material is provided. The method includes applying a metal precursor formulation on a substrate; and exposing the metal precursor formulation applied on the substrate to a low-energy plasma, wherein the low-energy plasma is operated according to a set of exposure parameters.

公开(公告)号：US20180230294A1

公开(公告)日：2018-08-16

申请号：US15752929

申请日：2016-08-24

申请人： SABIC Global Technologies B.V.

发明人： Yunan CHENG ,  Shijie SONG

IPC分类号： C08K5/5313 ,  C08K7/14 ,  C08K3/22 ,  C08K7/00 ,  C08K3/08 ,  B29C45/00 ,  B29C35/08 ,  B29B7/90

CPC分类号： C08K5/5313 ,  B29B7/90 ,  B29C35/0805 ,  B29C45/0001 ,  B29C45/0005 ,  B29C2035/0838 ,  B29K2077/00 ,  B29K2105/0005 ,  B29K2105/16 ,  B29K2309/08 ,  B29K2479/085 ,  B29K2505/02 ,  C08K3/08 ,  C08K3/22 ,  C08K5/49 ,  C08K7/00 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2201/003 ,  C08K2201/005 ,  C23C18/1641 ,  C23C18/38 ,  C08L77/06

摘要： Disclosed herein are laser activatable compositions. One composition may comprise: about 35% to about 75% by weight of at least one polyamide resin, preferably a 9,T resin; about 0.1% to about 20% by weight of a laser direct structuring additive; the laser activatable additive being operative to plate the composition upon being activated by a laser; about 0.5% to 20% by weight of a phosphorus-containing additive, preferably an organo phosphinate salt; and about 10% to 50% by weight of a reinforcing fiber, preferably a glass fiber having a substantially circular cross-section, the substantially circular cross-section having a diameter of 10 microns or less; where all weight percents are based on the total weight of the composition. Further embodiments provide compositions further comprising one or more organic, metallic, or mineral fillers, pigments, or combinations thereof. Also disclosed are methods of preparing these compositions and articles produced therefrom.

公开(公告)号：US20180209048A1

公开(公告)日：2018-07-26

申请号：US15412464

申请日：2017-01-23

申请人： Rohm and Haas Electronic Materials LLC

发明人： Meng Qi ,  Sze Wei Chum ,  Ping Ling Li

IPC分类号： C23C18/38 ,  C09D1/00 ,  C09D7/12

CPC分类号： C23C18/38 ,  C09D1/00 ,  C09D7/48 ,  C23C18/40 ,  C23C18/405

摘要： Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.