摘要:
A photomask according to the invention provides selective regional optimization of illumination type according to the type of image being formed using the photomask. The photomask include a light polarizing structure which polarizes the light incident on the polarizing structure. Light of a first illumination type from a source in a photolithographic exposure system is incident on the photomask. A portion of the light is incident on the region of the photomask that includes the polarizing structure, and another portion of the light is incident on another region of the photomask that does not include a polarizing structure. The illumination type of the light incident on the polarizing structure is changed to a second illumination type such that light incident on a substrate such as an integrated circuit wafer from the region of the photomask that has the polarizing structure is of the second illumination type. The illumination type of the portion of the light that is not incident on the polarizing structure is not changed, such that light from that portion of the photomask incident on another region of the wafer is of the first illumination type. By selectively regionally controlling illumination type in the photolithography process, resolution of the exposure system is optimized in all regions of the wafer.
摘要:
In one embodiment, the nozzle includes a first body having an open lower surface and a plurality of buffer spaces to store a processing solution therein. A first shutter is disposed at a lower part of the first body to selectively open and close lower surfaces of the buffer spaces, and a driving unit configured to move the first shutter or the first body so that a position of the first shutter is varied relative to the buffer spaces.
摘要:
An approach to correcting non-uniformity of critical dimension (CD) in a semiconductor wafer includes measuring 0th-order light transmitted through or reflected from a photomask in a plurality of regions of the photomask. The photomask is altered to equalize the 0th-order light from the photomask such that the wafer CD is uniform. The photomask can be altered such as by forming a phase grating on the back side of the photomask or by introducing shadowing elements into the photomask to alter the transmittance of the photomask.
摘要:
A photomask according to the invention provides selective regional optimization of illumination type according to the type of image being formed using the photomask. The photomask include a light polarizing structure which polarizes the light incident on the polarizing structure. Light of a first illumination type from a source in a photolithographic exposure system is incident on the photomask. A portion of the light is incident on the region of the photomask that includes the polarizing structure, and another portion of the light is incident on another region of the photomask that does not include a polarizing structure. The illumination type of the light incident on the polarizing structure is changed to a second illumination type such that light incident on a substrate such as an integrated circuit wafer from the region of the photomask that has the polarizing structure is of the second illumination type. The illumination type of the portion of the light that is not incident on the polarizing structure is not changed, such that light from that portion of the photomask incident on another region of the wafer is of the first illumination type. By selectively regionally controlling illumination type in the photolithography process, resolution of the exposure system is optimized in all regions of the wafer.