ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING TARGET SUBSTRATE

    公开(公告)号:US20240103356A1

    公开(公告)日:2024-03-28

    申请号:US18528914

    申请日:2023-12-05

    IPC分类号: G03F1/60

    CPC分类号: G03F1/60

    摘要: An electronic device is provided. The electronic device includes a base and a conductive layer that is disposed on the base and patterned by a plurality of processes. The plurality of processes include providing a mask substrate. The mask substrate includes a first substrate and a patterned substrate. In the cross-sectional view, the width of the first substrate is greater than or equal to the width of the patterned substrate. The plurality of processes include arranging the mask substrate and the base correspondingly. The plurality of processes also include performing exposure and development processes on the conductive layer for patterning the conductive layer, and removing the mask substrate.

    MASK BLANK AND REFLECTIVE MASK
    4.
    发明公开

    公开(公告)号:US20240094621A1

    公开(公告)日:2024-03-21

    申请号:US18274183

    申请日:2022-02-08

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/24 G03F1/60 G03F1/80

    CPC分类号: G03F1/24 G03F1/60 G03F1/80

    摘要: A mask blank includes a substrate having a main surface on which a multilayer reflective film and the pattern-forming thin film are provided in this order. The thin film contains tantalum, niobium, and nitrogen. An X-ray diffraction pattern obtained by analyzing the thin film by Out-of-Plane measurement of X-ray diffraction satisfies the relationship of at least one of Imax1/Iavg1≤7.0 and Imax2/Iavg2≤1.0, where Imax1 is a maximum value of diffraction intensity at a diffraction angle 2θ in a range of 34 to 36 degrees, Iavg1 is an average value of diffraction intensity at a diffraction angle 2θ in a range 32 to 34 degrees, Imax2 is a maximum value of diffraction intensity at a diffraction angle 2θ of 40 to 42 degrees, and Iavg2 is an average value of diffraction intensity at a diffraction angle 2θ in a range of 38 to 40 degrees.

    SUBSTRATE FOR USE AS MASK BLANK, AND MASK BLANK

    公开(公告)号:US20170277034A1

    公开(公告)日:2017-09-28

    申请号:US15467031

    申请日:2017-03-23

    IPC分类号: G03F1/24 G03F1/60 G03F1/22

    CPC分类号: G03F1/24 G03F1/22 G03F1/60

    摘要: In a substrate for use as a mask blank including a first main surface, a normal region, a frame-shaped region and inner region are present on the first main surface. The frame-shaped region includes first to fourth corner region and first to fourth middle region. The inner region has a flatness of 100 nm or less, the flatness being determined on the basis of a least-squares plane PP1 of the normal region. When one of the corner regions is referred to as an n-th corner region and two middle regions nearest to the n-th corner region are respectively referred to as a first near middle region and a second near middle region, the specific relationship regarding the surface profile is satisfied in the n-th corner region and the first and second near middle regions.

    Mask blank substrate, mask blank, transfer mask, and method of manufacturing semiconductor device

    公开(公告)号:US09690189B2

    公开(公告)日:2017-06-27

    申请号:US14774267

    申请日:2014-06-19

    申请人: HOYA CORPORATION

    发明人: Masaru Tanabe

    摘要: Provided are a mask blank substrate which has effectively and extremely high principal surface flatness while a reduction in the manufacturing throughput of the mask blank substrate is suppressed, a mask blank, and a transfer mask. Also provided are manufacturing methods therefor.A virtual reference surface that becomes an optically effective flat reference surface defined by a Zernike polynomial which is composed of only terms in which the order of a variable related to a radius is the second or lower order, and includes one or more terms in which the order of the variable related to the radius is the second order is set, and a mask blank substrate satisfying the condition that data (PV value) relating to the difference between the maximum value and the minimum value of the difference data between the reference surface and the measured shape of the mask blank substrate is one-eighth or less of an exposure wavelength (A) is selected.