公开(公告)号：US08707238B2

公开(公告)日：2014-04-22

申请号：US13484531

申请日：2012-05-31

申请人： Yi-Lin Chuang ,  Cheng-Pin Chiu ,  Ching-Fang Chen ,  Ji-Jan Chen ,  Sandeep Kumar Goel ,  Yun-Han Lee ,  Charles C. C. Liu

发明人： Yi-Lin Chuang ,  Cheng-Pin Chiu ,  Ching-Fang Chen ,  Ji-Jan Chen ,  Sandeep Kumar Goel ,  Yun-Han Lee ,  Charles C. C. Liu

IPC分类号： G06F17/50

CPC分类号： G01R31/2889

摘要： The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.

摘要翻译： 本公开涉及一种将探针焊盘布置到插入件的微凸块的方法。 提供具有目标微凸块和探针垫的插入件。 探针垫最初未分配。 获得目标微凸点位置和探针垫位置。 获得从探针焊盘到目标微凸块的可能路线分配。 至少部分地根据目标微凸块位置和探针垫位置为可能的路线分配开发成本。 根据成本从可能的分配中选择最终作业。