公开(公告)号：US09817029B2

公开(公告)日：2017-11-14

申请号：US13313228

申请日：2011-12-07

申请人： Mill-Jer Wang ,  Ching-Fang Chen ,  Sandeep Kumar Goel ,  Chung-Sheng Yuan ,  Chao-Yang Yeh ,  Chin-Chou Liu ,  Yun-Han Lee ,  Hung-Chih Lin

发明人： Mill-Jer Wang ,  Ching-Fang Chen ,  Sandeep Kumar Goel ,  Chung-Sheng Yuan ,  Chao-Yang Yeh ,  Chin-Chou Liu ,  Yun-Han Lee ,  Hung-Chih Lin

IPC分类号： G01R1/067 ,  G01R1/073

CPC分类号： G01R1/07342 ,  G01R1/07378 ,  H01L2224/16225

摘要： A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

公开(公告)号：US08984728B2

公开(公告)日：2015-03-24

申请号：US13468039

申请日：2012-05-10

申请人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

发明人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

IPC分类号： B23P19/04 ,  B25B27/02

CPC分类号： B25B27/023 ,  Y10T29/53843 ,  Y10T29/53857

摘要： A drawing device of the present invention includes a first driving element, a bolt, a plurality of second driving elements, and a plurality of clipping rods. The first driving element drives the second driving elements to rotate simultaneously, so that the clipping rods are able to be rotated and operated. Also, a hook portion of each clipping rod is able to hook to a bottom of objects to be drawn out, and the bolt is disposed on a threaded hole of the first driving element and abuts against the objects to be drawn out. At the same time, the clipping rods are moved outward.

摘要翻译： 本发明的拉伸装置包括第一驱动元件，螺栓，多个第二驱动元件和多个夹紧杆。 第一驱动元件驱动第二驱动元件同时旋转，使得夹杆能够旋转和操作。 此外，每个夹杆的钩部能够钩挂到待拉出的物体的底部，并且螺栓设置在第一驱动元件的螺纹孔上并抵靠被抽出的物体。 同时，夹杆向外移动。

公开(公告)号：US08863062B2

公开(公告)日：2014-10-14

申请号：US13544009

申请日：2012-07-09

申请人： Yi-Lin Chuang ,  Ji-Jan Chen ,  Ching-Fang Chen ,  Yun-Han Lee

发明人： Yi-Lin Chuang ,  Ji-Jan Chen ,  Ching-Fang Chen ,  Yun-Han Lee

IPC分类号： G06F17/50

CPC分类号： G06F17/5072 ,  G06F17/5077 ,  G06F2217/40

摘要： Methods and apparatus of performing floorplanning and routing for function blocks within a die and among multiple die are disclosed. Multiple die together with function blocks within each die may be represented by a flexible hierarchical (FH) tree. An initial floorplan for multiple die may be generated and hot spots between die or among function blocks within a die may be identified. Spacer blocks may be inserted between die, and block inflation may be performed, to remove hot spots. More perturbation of the block positions can be performed on the FH tree to rearrange the blocks and die. After the multiple die floorplanning, a plurality of micro bumps may be mapped to a plurality of pins of blocks of the plurality of die, placement and routing may be performed for the plurality of blocks within each die and connections for the plurality of dies.

摘要翻译： 公开了对模具内和多个模具中的功能块执行布局规划和布线的方法和装置。 每个管芯中的多个管芯与功能块一起可以由柔性分层（FH）树表示。 可以产生多个管芯的初始平面图，并且可以识别管芯内的管芯之间的热点或管芯内的功能块之间的热点。 间隔块可以插入管芯之间，并且可以执行块膨胀以去除热点。 可以在FH树上执行更多的块位置的扰动，以重新排列块并死亡。 在多芯片布局图之后，可以将多个微凸块映射到多个芯片的块的多个引脚，可以针对每个管芯内的多个块执行放置和布线，并为多个管芯提供连接。

公开(公告)号：US08707238B2

公开(公告)日：2014-04-22

申请号：US13484531

申请日：2012-05-31

申请人： Yi-Lin Chuang ,  Cheng-Pin Chiu ,  Ching-Fang Chen ,  Ji-Jan Chen ,  Sandeep Kumar Goel ,  Yun-Han Lee ,  Charles C. C. Liu

发明人： Yi-Lin Chuang ,  Cheng-Pin Chiu ,  Ching-Fang Chen ,  Ji-Jan Chen ,  Sandeep Kumar Goel ,  Yun-Han Lee ,  Charles C. C. Liu

IPC分类号： G06F17/50

CPC分类号： G01R31/2889

摘要： The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.

摘要翻译： 本公开涉及一种将探针焊盘布置到插入件的微凸块的方法。 提供具有目标微凸块和探针垫的插入件。 探针垫最初未分配。 获得目标微凸点位置和探针垫位置。 获得从探针焊盘到目标微凸块的可能路线分配。 至少部分地根据目标微凸块位置和探针垫位置为可能的路线分配开发成本。 根据成本从可能的分配中选择最终作业。

公开(公告)号：US20130290914A1

公开(公告)日：2013-10-31

申请号：US13544009

申请日：2012-07-09

申请人： Yi-Lin Chuang ,  Ji-Jan Chen ,  Ching-Fang Chen ,  Yun-Han Lee

发明人： Yi-Lin Chuang ,  Ji-Jan Chen ,  Ching-Fang Chen ,  Yun-Han Lee

IPC分类号： G06F17/50 ,  G06F9/455

CPC分类号： G06F17/5072 ,  G06F17/5077 ,  G06F2217/40

摘要： Methods and apparatus of performing floorplanning and routing for function blocks within a die and among multiple die are disclosed. Multiple die together with function blocks within each die may be represented by a flexible hierarchical (FH) tree. An initial floorplan for multiple die may be generated and hot spots between die or among function blocks within a die may be identified. Spacer blocks may be inserted between die, and block inflation may be performed, to remove hot spots. More perturbation of the block positions can be performed on the FH tree to rearrange the blocks and die. After the multiple die floorplanning, a plurality of micro bumps may be mapped to a plurality of pins of blocks of the plurality of die, placement and routing may be performed for the plurality of blocks within each die and connections for the plurality of dies.

摘要翻译： 公开了对模具内和多个模具中的功能块执行布局规划和布线的方法和装置。 每个管芯中的多个管芯与功能块一起可以由柔性分层（FH）树表示。 可以产生多个管芯的初始平面图，并且可以识别管芯内的管芯之间的热点或管芯内的功能块之间的热点。 间隔块可以插入管芯之间，并且可以执行块膨胀以去除热点。 可以在FH树上执行更多的块位置的扰动，以重新排列块并死亡。 在多芯片布局图之后，可以将多个微凸块映射到多个芯片的块的多个引脚，可以针对每个管芯内的多个块执行放置和布线，并为多个管芯提供连接。

公开(公告)号：US08490518B2

公开(公告)日：2013-07-23

申请号：US13039319

申请日：2011-03-03

申请人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

发明人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

IPC分类号： B25B17/00 ,  B25B13/28 ,  B67B7/15

CPC分类号： B25B27/0042

摘要： According to the present invention, the oil filter replacement device has a number of pins for clamping an oil filter, and the pins are extended eccentrically from corresponding secondary gear members. The secondary gear members are engaged to spin simultaneously by a main gear member. As such, the pins could be adjusted to fit on oil filters of various sizes. Additionally, each pin is rotatable and has at least a flat face. As the pins rolls along the circumference of the oil filter, their flat faces are turned to interface the flat faces around the oil filter. As such, the oil filter is tightly and reliably clamped by the oil filter replacement device, thereby preventing the problem of uneven exertion of force and deforming the oil filter.

摘要翻译： 根据本发明，油过滤器更换装置具有用于夹持油过滤器的多个销，并且销从相应的次级齿轮构件偏心地延伸。 次级齿轮构件被主齿轮构件同时旋转。 因此，可以调节销以适应各种尺寸的油过滤器。 此外，每个销可旋转并且至少具有平坦的面。 当销沿着油过滤器的圆周滚动时，它们的平面被转动以将油面过滤器周围的平面接合。 因此，油过滤器被油过滤器更换装置牢固可靠地夹紧，从而防止力不均匀的发生和油过滤器变形的问题。

公开(公告)号：US20130147505A1

公开(公告)日：2013-06-13

申请号：US13313228

申请日：2011-12-07

申请人： Mill-Jer WANG ,  Ching-Fang CHEN ,  Sandeep Kumar GOEL ,  Chung-Sheng YUAN ,  Chao-Yang YEH ,  Chin-Chou LIU ,  Yun-Han LEE ,  Hung-Chih LIN

发明人： Mill-Jer WANG ,  Ching-Fang CHEN ,  Sandeep Kumar GOEL ,  Chung-Sheng YUAN ,  Chao-Yang YEH ,  Chin-Chou LIU ,  Yun-Han LEE ,  Hung-Chih LIN

IPC分类号： G01R1/067

CPC分类号： G01R1/07342 ,  G01R1/07378 ,  H01L2224/16225

摘要： A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

摘要翻译： 用于晶圆级测试的半导体IC封装器件（DUT）的测试探针结构。 该结构包括衬底，通过衬底通孔，形成在用于接合探针卡的衬底的第一表面上的凸块阵列，以及在衬底的第二表面上的至少一个探测单元。 探测单元包括形成在衬底的一个表面上的导电探针焊盘和与衬垫相互连接的至少一个微型凹坑。 焊盘通过通孔电连接到凸块阵列。 一些实施例包括与衬垫相关联的多个微胶囊，其被配置成接合DUT上的微胶囊的匹配阵列。 在一些实施例中，可以通过将来自探针卡的测试信号通过凸块和微型阵列来探测DUT，而不直接探测DUT微胶囊。

公开(公告)号：US20120284982A1

公开(公告)日：2012-11-15

申请号：US13468039

申请日：2012-05-10

申请人： Lung-Shan CHEN ,  Lien-Chin Chen ,  Ching-Fang Chen

发明人： Lung-Shan CHEN ,  Lien-Chin Chen ,  Ching-Fang Chen

IPC分类号： B23P19/04

CPC分类号： B25B27/023 ,  Y10T29/53843 ,  Y10T29/53857

摘要： A drawing device of the present invention includes a first driving element, a bolt, a plurality of second driving elements, and a plurality of clipping rods. The first driving element drives the second driving elements to rotate simultaneously, so that the clipping rods are able to be rotated and operated. Also, a hook portion of each clipping rod is able to hook to a bottom of objects to be drawn out, and the bolt is disposed on a threaded hole of the first driving element and abuts against the objects to be drawn out. At the same time, the clipping rods are moved outward.

摘要翻译： 本发明的拉伸装置包括第一驱动元件，螺栓，多个第二驱动元件和多个夹紧杆。 第一驱动元件驱动第二驱动元件同时旋转，使得夹杆能够旋转和操作。 此外，每个夹杆的钩部能够钩挂到待拉出的物体的底部，并且螺栓设置在第一驱动元件的螺纹孔上并抵靠被抽出的物体。 同时，夹杆向外移动。

公开(公告)号：US20120079919A1

公开(公告)日：2012-04-05

申请号：US13209347

申请日：2011-08-12

申请人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

发明人： Lung-Shan Chen ,  Lien-Chin Chen ,  Ching-Fang Chen

IPC分类号： B25B13/28 ,  B25B13/48

CPC分类号： B25B27/0042 ,  B25B13/44

摘要： An oil filter canister adapter of the present invention mainly includes a base, a rotatable plate, three rotatable members, and three holders. The rotatable plate and the rotatable members are respectively disposed on the base. The rotatable members contact with the rotatable plate respectively, so that the rotatable plate can rotate and drive the rotatable members to rotate. The holders are detachably disposed on the rotatable members respectively. Distances between any two adjacent holders are consistent in value. The distances between the holders are adjustable when the rotatable members rotate.Therefore, the holders can be detached from the rotatable members. Volume of the adapter is minimized for storage. As such, cost of transportation or storage of the adapter can be well controlled.

摘要翻译： 本发明的油过滤器适配器主要包括基座，可旋转板，三个可旋转构件和三个保持器。 可旋转板和可旋转构件分别设置在基座上。 可旋转构件分别与可旋转板接触，使得可旋转板可旋转并驱动可旋转构件旋转。 保持器分别可拆卸地设置在可旋转构件上。 任何两个相邻持有人之间的距离是一致的。 当可旋转构件旋转时，保持器之间的距离是可调节的。 因此，保持器可以从可旋转构件脱离。 适配器的容积被最小化存储。 因此，可以良好地控制适配器的运输或存储成本。

公开(公告)号：US09040986B2

公开(公告)日：2015-05-26

申请号：US13356243

申请日：2012-01-23

申请人： Ching-Fang Chen ,  Hsiang-Tai Lu ,  Chih-Hsien Lin

发明人： Ching-Fang Chen ,  Hsiang-Tai Lu ,  Chih-Hsien Lin

IPC分类号： H01L23/58 ,  H01L29/10 ,  H01L21/66 ,  H01L23/12 ,  H01L23/498 ,  H01L23/00

CPC分类号： G01R31/2886 ,  G01R31/2856 ,  H01L22/34 ,  H01L23/12 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01047

摘要： A three-dimensional integrated circuit (3DIC) including a top chip having at least one active device and an interposer having conductive routing layers and vias. The 3DIC further includes a plurality of conductive connectors configured to electrically connect the top chip and the interposer. The 3DIC further includes a conductive line over at least one of the top chip or the interposer. The conductive line traces a perimeter of top chip or interposer parallel to an outer edge of the top chip or interposer. The conductive line is configured to electrically connect the conductive connectors. The 3DIC further includes at least one testing element over at least one of the top chip or the interposer. The testing element is configured to electrically connect to the plurality of conductive connectors.

摘要翻译： 一种三维集成电路（3DIC），包括具有至少一个有源器件的顶部芯片和具有导电布线层和通孔的插入器。 3DIC还包括被配置为电连接顶部芯片和插入器的多个导电连接器。 3DIC还包括在顶部芯片或插入件中的至少一个上的导电线。 导线跟踪平行于顶部芯片或插入件的外边缘的顶部芯片或插入件的周边。 导线被配置为电连接导电连接器。 3DIC还包括至少一个测试元件在至少一个顶部芯片或插入器上。 测试元件被配置为电连接到多个导电连接器。