OPTICAL PICKUP HEAD
    1.
    发明申请
    OPTICAL PICKUP HEAD 有权
    光学拾取头

    公开(公告)号:US20120213051A1

    公开(公告)日:2012-08-23

    申请号:US13360182

    申请日:2012-01-27

    摘要: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

    摘要翻译: 提供一种光拾取头,其包括硅衬底,其中孔和物镜设置在硅衬底上; 并且在硅衬底上设置激光二极管(LD),135度倾斜反射器和135度倾斜全息反射器。 使用半导体工艺在两个135度倾斜反射器和全息光学元件(HOE)上制造在光学平台的倾斜面结构上,因此所有元件都设置在直线区域,然后与 LD和光学传感器元件,实现了小型化的目的,缩短了光路。

    Optical pickup head
    2.
    发明授权
    Optical pickup head 有权
    光学拾音头

    公开(公告)号:US08477573B2

    公开(公告)日:2013-07-02

    申请号:US13360182

    申请日:2012-01-27

    IPC分类号: G11B7/00

    摘要: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

    摘要翻译: 提供一种光拾取头,其包括硅衬底,其中孔和物镜设置在硅衬底上; 并且在硅衬底上设置激光二极管(LD),135度倾斜反射器和135度倾斜全息反射器。 使用半导体工艺在两个135度倾斜反射器和全息光学元件(HOE)上制造在光学平台的倾斜面结构上,因此所有元件都设置在直线区域,然后与 LD和光学传感器元件,实现了小型化的目的,缩短了光路。

    THREE-DIMENSIONAL OBLIQUE MICROSTRUCTURE WITH PRESS DOWN AND ENGAGEMENT MECHANISMS
    3.
    发明申请
    THREE-DIMENSIONAL OBLIQUE MICROSTRUCTURE WITH PRESS DOWN AND ENGAGEMENT MECHANISMS 审中-公开
    具有下压和接合机构的三维OBLIQUE微结构

    公开(公告)号:US20120211630A1

    公开(公告)日:2012-08-23

    申请号:US13402640

    申请日:2012-02-22

    IPC分类号: F16M13/00

    摘要: A three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the α-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield.

    摘要翻译: 具有压下和接合机构的三维倾斜微结构。 一对相应的第一凸耳设置在倾斜体的两侧,并且倾斜体的底部具有第一推动垫。 分别设置在α形支撑架的两个支撑件的内侧上的一对对应的第二凸耳,第二推垫设置在U形支撑架的底部上。 因此,通过按压第一和第二推动垫,倾斜体旋转穿过第一扭转杆,并且U形支撑架通过第二扭杆旋转,从而将第一凸起与第二凸耳接合,使得 可以填充具有不同角度的三维微结构以满足各种光学平台应用的需要,并且简化半导体制造以提高生产效率和产品产量。