公开(公告)号：US08544745B2

公开(公告)日：2013-10-01

申请号：US13247396

申请日：2011-09-28

申请人： Gregory Loyd Mullins ,  Chi-Lun Lin ,  Zhuo Chen

发明人： Gregory Loyd Mullins ,  Chi-Lun Lin ,  Zhuo Chen

IPC分类号： H01R13/00

CPC分类号： H05K5/0256 ,  H05K7/2049

摘要： This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

摘要翻译： 本公开涉及与用于连接到电子设备的读卡器一起使用的散热卡连接器相关联的装置，系统和方法。 连接器具有被配置为当卡被插入读卡器时接收具有电路的卡的主体。 连接器主体包括多个电子触头，其接合卡电路并将卡可操作地连接到电子设备。 连接器主体包括至少一个包括卡接合部分的导热弹簧。 当卡插入读卡器时，卡片接合部分接触卡片并从卡片引导热量。 当卡被插入读卡器中时，导热元件（也是导热弹簧的一部分）将热量从卡接合部分传递到电子设备的散热结构。

公开(公告)号：US20150049082A1

公开(公告)日：2015-02-19

申请号：US14459163

申请日：2014-08-13

申请人： Dane Coffey ,  Daniel F. Keefe ,  Arthur G. Erdman ,  Benjamin J. Bidne ,  Gregory Ernest Ostenson ,  David M. Flynn ,  Kenneth Matthew Merdan ,  Chi-Lun Lin

发明人： Dane Coffey ,  Daniel F. Keefe ,  Arthur G. Erdman ,  Benjamin J. Bidne ,  Gregory Ernest Ostenson ,  David M. Flynn ,  Kenneth Matthew Merdan ,  Chi-Lun Lin

IPC分类号： G06T17/00

CPC分类号： G06T19/20 ,  A61B34/10 ,  A61B2017/00243 ,  A61B2017/00778 ,  A61B2034/102 ,  A61B2034/104 ,  A61B2034/105 ,  A61B2034/107 ,  A61B2034/2055 ,  A61B2090/368 ,  G06F3/01 ,  G06F3/011 ,  G06K9/4604 ,  G06K2009/4666 ,  G06T7/0012 ,  G06T13/20 ,  G06T15/00 ,  G06T17/00 ,  G06T19/006 ,  G06T2207/10076 ,  G06T2207/30004 ,  G06T2207/30048 ,  G06T2207/30101 ,  G06T2211/40 ,  G06T2219/00

摘要： A computer-implemented method for medical device modeling includes accessing an electronic definition for a model of a three-dimensional item and an electronic definition of a three-dimensional spline relating to an internal anatomical volume; determining, with a computer-based finite element analysis system and using the electronic definitions, stresses created by the three-dimensional item along the three-dimensional spline, for different points along the three-dimensional spline; and displaying stress data generated by the finite element analysis system with a visualization system, the display of the stress data indicating levels of stress on portions of the three-dimensional item at particular locations along the three-dimensional spline.

摘要翻译： 用于医疗设备建模的计算机实现的方法包括访问用于三维物体的模型的电子定义和与内部解剖体积有关的三维样条的电子定义; 使用基于计算机的有限元分析系统和使用电子定义，沿着三维样条线，沿着三维样条线的不同点，由三维项目产生的应力; 以及通过可视化系统显示由有限元分析系统生成的应力数据，显示应力数据，其指示沿着三维样条的特定位置处的三维物体的部分上的应力水平。

公开(公告)号：US20120190247A1

公开(公告)日：2012-07-26

申请号：US13298719

申请日：2011-11-17

申请人： Earl Anthony Daughtry ,  Yi Fei Luo ,  Chi-Lun Lin

发明人： Earl Anthony Daughtry ,  Yi Fei Luo ,  Chi-Lun Lin

IPC分类号： H01R24/28 ,  H05K3/36

CPC分类号： H01R12/57 ,  H01R12/7076 ,  H01R12/7082

摘要： This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.

摘要翻译： 本公开涉及与用于表面贴装技术（SMT）的连接器组件相关联的装置，系统和方法。 连接器组件具有连接器插头，其被构造成安装到电路板上，并且由适用于回流焊接工艺的耐高温材料构成。 连接器插头包括至少一个连接器插座和至少一个安装肩部，并且被配置为联接到插头连接组件。 插头连接组件包括至少一个连接器插脚和至少一个安装肩部，并且被配置为联接到连接器插头。 诸如读卡器或硬盘驱动器的电子设备可以连接到插头连接组件，从而连接到电路板。 连接器组件允许在手动或自动组装过程中插入和附接的障碍物视图。

公开(公告)号：US20120325908A1

公开(公告)日：2012-12-27

申请号：US13247396

申请日：2011-09-28

申请人： Gregory Loyd Mullins ,  Chi-Lun Lin ,  Zhuo Chen

发明人： Gregory Loyd Mullins ,  Chi-Lun Lin ,  Zhuo Chen

IPC分类号： G06K7/06 ,  H01R12/71

CPC分类号： H05K5/0256 ,  H05K7/2049

摘要： This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

摘要翻译： 本公开涉及与用于连接到电子设备的读卡器一起使用的散热卡连接器相关联的装置，系统和方法。 连接器具有被配置为当卡被插入读卡器时接收具有电路的卡的主体。 连接器主体包括多个电子触头，其接合卡电路并将卡可操作地连接到电子设备。 连接器主体包括至少一个包括卡接合部分的导热弹簧。 当卡插入读卡器时，卡片接合部分接触卡片并从卡片引导热量。 当卡被插入读卡器中时，导热元件（也是导热弹簧的一部分）将热量从卡接合部分传递到电子设备的散热结构。