公开(公告)号：US08497695B2

公开(公告)日：2013-07-30

申请号：US12227441

申请日：2007-06-13

申请人： Chiaki Matoba ,  Kei Kobayashi

发明人： Chiaki Matoba ,  Kei Kobayashi

IPC分类号： G01R31/3187

CPC分类号： G01R31/2856 ,  H01L21/78 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device (1) detecting damage to the peripheral part of a chip which could potentially grow into a defect includes: a wire (3) formed along the outer periphery of a semiconductor chip (2d) to detect damage; a detection circuit (4) provided in the semiconductor chip (2) to supply a detection signal to the wire (3) to detect a break in the wire (3); an output terminal (5) for outputting the detection signal having passed through the wire (3); an internal circuit (6) provided in the semiconductor chip (2); an output switching circuit (7) selecting either an output signal of the internal circuit (6) or the detection signal having passed the wire (3) for output to the output terminal (5); a heating element (15a) heating the peripheral part of the chip; a power supply circuit (16) supplying power to the heating element; and a temperature detection/control circuit (17) controlling the heating by the heating element. This configuration enables easy detection of damage to the chip by logic test without additional measurement terminals. The configuration also enables detection of chips which could develop a defect when packaged.

摘要翻译： 检测对潜在生长成缺陷的芯片的周边部分的损坏的半导体器件（1）包括：沿着半导体芯片（2d）的外周形成的用于检测损伤的线（3） 设置在半导体芯片（2）中的检测电路（4），用于向线（3）提供检测信号以检测线（3）中的断裂; 输出端子（5），用于输出已经通过导线（3）的检测信号; 设置在所述半导体芯片（2）中的内部电路（6） 输出切换电路（7），选择内部电路（6）的输出信号或通过导线（3）的检测信号输出到输出端子（5）; 加热芯片周边部分的加热元件; 电源电路（16），向所述加热元件供电; 以及控制加热元件的加热的温度检测/控制电路（17）。 该配置可以通过逻辑测试轻松检测芯片的损坏，无需附加的测量端子。 该配置还能够检测在封装时可能产生缺陷的芯片。

公开(公告)号：US20100240418A1

公开(公告)日：2010-09-23

申请号：US12659555

申请日：2010-03-12

申请人： Chiaki Matoba

发明人： Chiaki Matoba

IPC分类号： G09G3/36 ,  H04M1/00

CPC分类号： G09G3/3406 ,  G09G2330/021 ,  G09G2360/145

摘要： An automated light control system for controlling light emission from the backlight of the liquid crystal display in such a manner that the power consumption can be reduced, taking the information on the brightness in the peripheral region and the information on the distance into total consideration, is provided. The automated light control system is characterized in that a brightness information detecting means for detecting the brightness in the periphery and outputting information on the brightness for indicating the brightness and a distance information detecting means for outputting information on the distance for indicating the distance between the liquid crystal display and the user are provided, and the amount of light emitted by the light illumination means (backlight) is controlled on the basis of both the above described information on the brightness and the above described information on the distance.

摘要翻译： 一种自动化的光控制系统，用于以能够减少功耗的方式控制来自液晶显示器的背光的光发射，将关于周边区域的亮度的信息和关于距离的信息总的考虑在内的方式是 提供。 自动光控制系统的特征在于：用于检测周边亮度并输出用于指示亮度的亮度的信息的亮度信息检测装置和用于输出关于指示液体之间的距离的距离的信息的距离信息检测装置 提供晶体显示器和用户，并且基于上述关于亮度的信息和上述关于距离的信息两者来控制由光照明装置（背光）发射的光量。

公开(公告)号：US20090174426A1

公开(公告)日：2009-07-09

申请号：US12227441

申请日：2007-06-13

申请人： Chiaki Matoba ,  Kei Kobayashi

发明人： Chiaki Matoba ,  Kei Kobayashi

IPC分类号： G01R31/02

CPC分类号： G01R31/2856 ,  H01L21/78 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device (1) detecting damage to the peripheral part of a chip which could potentially grow into a defect includes: a wire (3) formed along the outer periphery of a semiconductor chip (2d) to detect damage; a detection circuit (4) provided in the semiconductor chip (2) to supply a detection signal to the wire (3) to detect a break in the wire (3); an output terminal (5) for outputting the detection signal having passed through the wire (3); an internal circuit (6) provided in the semiconductor chip (2); an output switching circuit (7) selecting either an output signal of the internal circuit (6) or the detection signal having passed the wire (3) for output to the output terminal (5); a heating element (15a) heating the peripheral part of the chip; a power supply circuit (16) supplying power to the heating element; and a temperature detection/control circuit (17) controlling the heating by the heating element. This configuration enables easy detection of damage to the chip by logic test without additional measurement terminals. The configuration also enables detection of chips which could develop a defect when packaged.

摘要翻译： 检测对潜在生长成缺陷的芯片的周边部分的损坏的半导体器件（1）包括：沿着半导体芯片（2d）的外周形成的用于检测损伤的线（3） 设置在半导体芯片（2）中的检测电路（4），用于向线（3）提供检测信号以检测线（3）中的断裂; 输出端子（5），用于输出已经通过导线（3）的检测信号; 设置在所述半导体芯片（2）中的内部电路（6） 输出切换电路（7），选择内部电路（6）的输出信号或通过导线（3）的检测信号输出到输出端子（5）; 加热芯片周边部分的加热元件; 电源电路（16），向所述加热元件供电; 以及控制加热元件的加热的温度检测/控制电路（17）。 该配置可以通过逻辑测试轻松检测芯片的损坏，无需附加的测量端子。 该配置还能够检测在封装时可能产生缺陷的芯片。