公开(公告)号：US07911798B2

公开(公告)日：2011-03-22

申请号：US12260094

申请日：2008-10-29

申请人： Chih-I Chang ,  Chih-Chieh Chang

发明人： Chih-I Chang ,  Chih-Chieh Chang

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory heat sink device having an enlarged heat dissipating area is provided. The memory heat sink device includes two cooling fins that are respectively attached to a front side and a back side of a memory. Raised dots are protruded from a front (or back) side of the cooling fin attached to the front (or back) side of the memory. Each of the raised dots on the cooling fin has at least one sectional area and at least one connection portion. Thus, the heat sink area of the cooling fin increases and heat generated by the memory is easily dissipated by the sectional area through thermal convection.

摘要翻译： 提供了具有放大的散热区域的存储器散热装置。 存储器散热器装置包括两个分别安装在存储器的前侧和后侧的散热片。 凸起的点从附接到存储器的前（或后）侧的散热片的前（或后）侧突出。 冷却翅片上的每个凸点具有至少一个截面面积和至少一个连接部分。 因此，冷却翅片的散热片面积增加，由存储器产生的热容易通过热对流的截面积消散。

公开(公告)号：US20090122481A1

公开(公告)日：2009-05-14

申请号：US12260094

申请日：2008-10-29

申请人： Chih-I Chang ,  Chih-Chieh Chang

发明人： Chih-I Chang ,  Chih-Chieh Chang

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory heat sink device provided with an extra heat sink area includes two cooling fins that are respectively attached to the front and back sides of a memory. A plurality of raised dots that protrude toward the front side are formed on the cooling fin attached to the front side of the memory. Each of the raised dots and the cooling fin has at least one sectional area and one connection portion. Thus, the heat sink area of cooling fin increases and the sectional area is used to easily dissipate heat generated by the memory in the manner of convection.

摘要翻译： 设置有额外的散热器区域的存储器散热器装置包括分别附接到存储器的前侧和后侧的两个散热片。 在安装在存储器前侧的冷却片上形成有朝向前侧突出的多个凸点。 凸起点和冷却翅片中的每一个具有至少一个截面面积和一个连接部分。 因此，冷却翅片的散热片面积增大，截面面积容易以对流的方式散发由存储器产生的热量。