公开(公告)号：US20110101285A1

公开(公告)日：2011-05-05

申请号：US12717110

申请日：2010-03-03

Applicant: Chu-Lung Chao ,  Yu-Chen Chang ,  Chong-Chieh Cheng ,  Ying-Chih Lu ,  Cheng-Hsun Lin ,  Wen-Jui Huang

Inventor： Chu-Lung Chao ,  Yu-Chen Chang ,  Chong-Chieh Cheng ,  Ying-Chih Lu ,  Cheng-Hsun Lin ,  Wen-Jui Huang

IPC: H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K3/40 ,  C08K5/0091 ,  H01L31/022425 ,  Y02E10/50

Abstract: A conductive paste includes: at least one metal powder, an organic vehicle, a glass and a surfactant having a representative formula as follows: Mx(R)y(Q)z, wherein M is selected from a metal element and a semiconductive element, R is hydrophilic group directly connected to M and one will be able to hydrolyze by water to form another hydrophilic group, and Q is a hydrophobic group. The hydrophilic functional group of the surfactant will attach on the metal powder surface closely. Therefore, the surfactant can disperse the metal powder in the organic vehicle well and prevent paste from aggregating.

Abstract translation: 导电浆料包括：至少一种金属粉末，有机载体，玻璃和具有如下代表性的表面活性剂：M x（R）y（Q）z，其中M选自金属元素和半导体元素， R是与M直接连接的亲水基团，一个能够被水水解形成另一个亲水基团，Q是疏水基团。 表面活性剂的亲水性官能团将紧密附着在金属粉末表面上。 因此，表面活性剂可以将金属粉末分散在有机载体中，防止糊料聚集。