SUB-MICRON LASER DIRECT WRITE
    1.
    发明申请
    SUB-MICRON LASER DIRECT WRITE 有权
    亚微米激光直接写入

    公开(公告)号:US20080314881A1

    公开(公告)日:2008-12-25

    申请号:US12141954

    申请日:2008-06-19

    IPC分类号: B23K26/00

    摘要: A method of directing a pulse of laser energy though a workpiece. The workpiece has: a substrate that transmits the laser energy; focusing elements on a surface of the substrate proximal to the laser that focus the laser energy; and a coating on the substrate distal to the laser that absorbs a portion of the laser energy. Each focusing element focuses the laser energy to a point that removes or ablates a portion of the coating from the substrate to produce a hole in the coating.

    摘要翻译: 通过工件引导激光能量的脉冲的方法。 工件具有:传递激光能量的基板; 聚焦元件在靠近激光的基板的表面上聚焦激光能量; 以及在激光器远端的衬底上的涂层,其吸收一部分激光能量。 每个聚焦元件将激光能量聚焦到从衬底移除或消除涂层的一部分以在涂层中产生孔的点。

    Sub-micron laser direct write
    2.
    发明授权
    Sub-micron laser direct write 有权
    亚微米激光直写

    公开(公告)号:US08101247B2

    公开(公告)日:2012-01-24

    申请号:US12141954

    申请日:2008-06-19

    IPC分类号: C23C14/30 C23C14/28 B05D3/00

    摘要: A method of directing a pulse of laser energy though a workpiece. The workpiece has: a substrate that transmits the laser energy; focusing elements on a surface of the substrate proximal to the laser that focus the laser energy; and a coating on the substrate distal to the laser that absorbs a portion of the laser energy. Each focusing element focuses the laser energy to a point that removes or ablates a portion of the coating from the substrate to produce a hole in the coating.

    摘要翻译: 通过工件引导激光能量的脉冲的方法。 工件具有:传递激光能量的基板; 聚焦元件在靠近激光的基板的表面上聚焦激光能量; 以及在激光器远端的衬底上的涂层,其吸收一部分激光能量。 每个聚焦元件将激光能量聚焦到从衬底移除或消除涂层的一部分以在涂层中产生孔的点。