SYSTEM AND METHOD FOR WAFER CARRIER VIBRATION REDUCTION
    1.
    发明申请
    SYSTEM AND METHOD FOR WAFER CARRIER VIBRATION REDUCTION 审中-公开
    用于减少载波振幅的系统和方法

    公开(公告)号:US20110094546A1

    公开(公告)日:2011-04-28

    申请号:US12620338

    申请日:2009-11-17

    IPC分类号: B08B3/00

    摘要: An aspect of the present invention provides a system and method for controlling a wafer cleaning system having a wafer carrier and a driving portion. The wafer carrier can move along a path in a first direction and a second direction. The driving portion can controllably move the wafer carrier in the first direction and the second direction. The control system includes a vibration sensor portion and a wafer carrier position controller. The vibration sensor portion can detect vibration of the wafer carrier and can output a vibration signal based on the detected vibration. The wafer carrier position controller can instruct the driving portion to modify motion of the wafer carrier based on the vibration signal to reduce the detected vibration.

    摘要翻译: 本发明的一个方面提供一种用于控制具有晶片载体和驱动部分的晶片清洁系统的系统和方法。 晶片载体可沿第一方向和第二方向的路径移动。 驱动部分可以在第一方向和第二方向上可控地移动晶片载体。 控制系统包括振动传感器部分和晶片载体位置控制器。 振动传感器部分可以检测晶片载体的振动,并且可以基于检测到的振动输出振动信号。 晶片载体位置控制器可以指示驱动部分基于振动信号修改晶片载体的运动,以减少检测到的振动。