公开(公告)号：US20130141883A1

公开(公告)日：2013-06-06

申请号：US13309424

申请日：2011-12-01

申请人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

发明人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

IPC分类号： H05K7/04 ,  H05K13/00 ,  H01P11/00 ,  H05K1/00

CPC分类号： H05K3/305 ,  H05K9/003 ,  H05K9/0037 ,  H05K2203/043 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4902

摘要： Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

公开(公告)号：US09113549B2

公开(公告)日：2015-08-18

申请号：US13309424

申请日：2011-12-01

申请人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

发明人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

IPC分类号： H05K9/00

CPC分类号： H05K3/305 ,  H05K9/003 ,  H05K9/0037 ,  H05K2203/043 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4902

摘要： Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

摘要翻译： 本公开的实施例描述了可用于多通道调制器驱动器（例如光调制器驱动器）中的信道隔离的机箱的技术和配置。 系统可以包括衬底，安装在衬底上的多通道调制器驱动器和安装在衬底上以覆盖多通道调制器驱动器的外壳，该外壳具有设置在多通道的第一部件之间的壁 与第一通道相关联的调制器驱动器和与第二通道相关联的多通道调制器驱动器的第二部件，该壁由导电材料组成。 其他实施例也可以被描述和/或要求保护。