公开(公告)号：US20050150933A1

公开(公告)日：2005-07-14

申请号：US11073073

申请日：2005-03-04

申请人： Anthony Chiu

发明人： Anthony Chiu

IPC分类号： H01L21/60 ,  H01L23/485 ,  B23K31/02

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85365 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.

摘要翻译： 公开了一种用于增加由球形接合中的小直径线制成的接合强度的系统和方法。 在本发明的一个实施例中，用于接收球接合的结构包括具有形成衬底空腔的部分和覆盖并填充衬底腔的引线接合焊盘的衬底材料。 引线接合焊盘还具有形成用于接收球接合的引线接合腔的部分。 球与引线接合腔的侧面和底部引线键合。 引线接合腔的侧面为接合提供额外的强度，以抵抗可能作用在电线上的剪切力和拉力。

公开(公告)号：US06214643B1

公开(公告)日：2001-04-10

申请号：US09434558

申请日：1999-11-12

申请人： Anthony Chiu

发明人： Anthony Chiu

IPC分类号： H01L2160

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L29/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/00

摘要： The bond between a flip chip integrated circuit and a substrate is subject to mechanical stress from thermal cycles. This problem is exaggerated when the substrate has a rate of thermal expansion which is appreciably different from that of silicon. This problem is further exaggerated when the IC has a large footprint because it will experience a larger absolute expansion. A solution is proposed to this problem which involves creating an anchoring point. The anchoring point can be in either the IC or the substrate and can be a through-hole or a surface indentation such as a groove or a cutout. The anchoring point is filled with the underfill material during the underfill process. The anchoring point thus provides additional mechanical strength to the bond between the IC and the substrate.

摘要翻译： 倒装芯片集成电路和基板之间的接合受到热循环的机械应力。 当衬底具有与硅的热膨胀率明显不同的热膨胀率时，这个问题被夸大了。 当IC具有较大的占用面积时，这个问题将进一步夸大，因为它将会经历更大的绝对扩展。 提出了一个解决方案，涉及创建一个锚定点。 锚定点可以在IC或基板中，并且可以是通孔或表面凹槽，例如凹槽或切口。 在底部填充过程中，锚固点填充有底部填充材料。 因此，锚固点为IC和基板之间的结合提供了额外的机械强度。

公开(公告)号：US20130141883A1

公开(公告)日：2013-06-06

申请号：US13309424

申请日：2011-12-01

申请人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

发明人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

IPC分类号： H05K7/04 ,  H05K13/00 ,  H01P11/00 ,  H05K1/00

CPC分类号： H05K3/305 ,  H05K9/003 ,  H05K9/0037 ,  H05K2203/043 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4902

摘要： Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

公开(公告)号：US07958557B2

公开(公告)日：2011-06-07

申请号：US11436751

申请日：2006-05-17

申请人： Anthony Chiu-Chi Kwan

发明人： Anthony Chiu-Chi Kwan

IPC分类号： G06F11/00 ,  G06F12/14 ,  G06F12/16 ,  G08B23/00

CPC分类号： H04L63/1441 ,  G06F21/552 ,  H04L63/1416

摘要： In certain embodiments, a method for tagging communications from a user system, such that a source of a malicious computer element in a computer network may be determined, includes determining tag information for a user system in the computer network, the tag information physically identifying the user system. The method further includes detecting an attempt to send a communication from the user system and, in response to detecting the attempt to send a communication from the user system, attaching the tag information to the communication prior to sending the communication from the user system. The attachment of the tag information to the communication allows the source of the communication to be determined in response to determining that the communication is associated with a malicious computer element, the source comprising the user system.

摘要翻译： 在某些实施例中，可以确定用于标记来自用户系统的通信的方法，使得计算机网络中的恶意计算机元件的源可以被确定，包括确定计算机网络中的用户系统的标签信息，标签信息物理地识别 用户系统。 该方法还包括检测从用户系统发送通信的尝试，并且响应于检测到从用户系统发送通信的尝试，在从用户系统发送通信之前将标签信息附加到通信。 响应于确定通信与恶意计算机元件相关联，包括用户系统的源将标签信息附加到通信允许确定通信源。

公开(公告)号：US20060261450A1

公开(公告)日：2006-11-23

申请号：US11410501

申请日：2006-04-25

申请人： Harry Siegel ,  Anthony Chiu

发明人： Harry Siegel ,  Anthony Chiu

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

摘要翻译： 提供了一种提供无引线封装结构的方法。 该方法包括提供临时载体。 临时载体与临时粘合剂层耦合到金属箔层。 集成电路芯片耦合到金属箔层。 在模制之后，移除临时粘合剂层和临时载体以形成无引线包装结构。

公开(公告)号：US20050253257A1

公开(公告)日：2005-11-17

申请号：US11030754

申请日：2005-01-06

申请人： Anthony Chiu ,  Yinon Degani ,  Charley Gao ,  Kunquan Sun ,  Liquo Sun

发明人： Anthony Chiu ,  Yinon Degani ,  Charley Gao ,  Kunquan Sun ,  Liquo Sun

IPC分类号： H01L27/04 ,  H01L21/00 ,  H01L21/02 ,  H01L21/822 ,  H01L21/8242 ,  H01L23/34 ,  H01L27/01

CPC分类号： H01L25/16 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48237 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The specification describes a multi-chip module (MCM) that contains an integrated passive device (IPD) as the carrier substrate (IPD MCM). Parasitic electrical interactions are controlled at one or both interfaces of the IPD either by eliminating metal from the interfaces, or by selective use of metal in parts of the MCM that are remote from the sensitive device components. The sensitive device components are primarily analog circuit components, especially RF inductor elements. In the IPD layout, the sensitive components are segregated from other components. This allows implementation of the selective metal approach. It also allows parasitic interactions on top of the IPD substrate to be reduced by selective placement of IC semiconductor chips and IC chip ground planes. In preferred embodiments of the IPD MCM of the invention, the IPD substrate is polysilicon, to further minimize RF interactions. The various methods of assembling the module may be adapted to keep the overall thickness within 1.0 mm.

摘要翻译： 该规范描述了一种包含集成无源器件（IPD）作为载体衬底（IPD MCM）的多芯片模块（MCM）。 通过从接口中消除金属，或通过选择性地使用远离敏感器件部件的MCM部分中的金属，在IPD的一个或两个接口处控制寄生电学相互作用。 敏感器件组件主要是模拟电路组件，特别是RF电感元件。 在IPD布局中，敏感组件与其他组件隔离。 这允许实施选择性金属方法。 它还允许通过IC半导体芯片和IC芯片接地层的选择性放置来减少IPD衬底顶部的寄生相互作用。 在本发明的IPD MCM的优选实施方案中，IPD衬底是多晶硅，以进一步最小化RF相互作用。 组装模块的各种方法可以适于将总体厚度保持在1.0mm内。

公开(公告)号：US06121678A

公开(公告)日：2000-09-19

申请号：US994741

申请日：1997-12-19

申请人： Anthony Chiu ,  Tom Quoc Lao ,  Harry Michael Siegel ,  Michael J. Hundt

发明人： Anthony Chiu ,  Tom Quoc Lao ,  Harry Michael Siegel ,  Michael J. Hundt

IPC分类号： H05K1/11 ,  H01L21/301 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01L23/49838 ,  H01L23/49805 ,  H01L23/49816 ,  H05K3/403 ,  H01L2924/0002 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/42

摘要： An apparatus and method for producing a wrap-around interconnect substrate (60) comprising a substrate (42) having semi-circular vias (62) having openings (64) created by separating through cylindrical vias (62) that were positioned along cutting lines (46a, 46b) that formed part of an integrated circuit substrate strip (40) prior to separation, is disclosed.

公开(公告)号：US09113549B2

公开(公告)日：2015-08-18

申请号：US13309424

申请日：2011-12-01

申请人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

发明人： Craig Steinbeiser ,  Khiem Dinh ,  Anthony Chiu

IPC分类号： H05K9/00

CPC分类号： H05K3/305 ,  H05K9/003 ,  H05K9/0037 ,  H05K2203/043 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4902

摘要： Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

摘要翻译： 本公开的实施例描述了可用于多通道调制器驱动器（例如光调制器驱动器）中的信道隔离的机箱的技术和配置。 系统可以包括衬底，安装在衬底上的多通道调制器驱动器和安装在衬底上以覆盖多通道调制器驱动器的外壳，该外壳具有设置在多通道的第一部件之间的壁 与第一通道相关联的调制器驱动器和与第二通道相关联的多通道调制器驱动器的第二部件，该壁由导电材料组成。 其他实施例也可以被描述和/或要求保护。

公开(公告)号：US20070001286A1

公开(公告)日：2007-01-04

申请号：US11517879

申请日：2006-09-08

申请人： Anthony Chiu ,  Tom Lao

发明人： Anthony Chiu ,  Tom Lao

IPC分类号： H01L23/12

CPC分类号： H01L23/562 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/341 ,  H05K2203/1178 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A system and method is disclosed for venting pressure from an integrated circuit package that is sealed with a lid. During a surface mount process for mounting a ball grid array integrated circuit package to a circuit board the application of heat (1) weakens the solder that seals a soldered lid, and (2) increases vapor pressure within the integrated circuit package. This may cause the soldered lid to move out of its soldered position. The present invention solves this problem by providing an integrated circuit with a solder mask that has a plurality of solder mask vents that form a plurality of vapor pressure vents through the solder. The vapor pressure vents prevent the occurrence of any increase in vapor pressure that would shift the soldered lid out of its soldered position. An alternate embodiment vents pressure through an epoxy layer that is used to attach a lid by epoxy.

摘要翻译： 公开了一种用于从由盖子密封的集成电路封装件排出压力的系统和方法。 在用于将球栅阵列集成电路封装安装到电路板的表面安装过程中，加热（1）的作用削弱了密封焊接盖的焊料，和（2）增加集成电路封装内的蒸汽压力。 这可能导致焊接的盖子从其焊接位置移出。 本发明通过提供具有焊料掩模的集成电路来解决这个问题，该焊接掩模具有多个通过焊料形成多个蒸汽压力通气口的焊接掩模排出口。 蒸汽压力通风口防止蒸汽压力的任何增加的发生，这将使焊接的盖子从其焊接位置移位。 替代实施例通过用于通过环氧树脂附接盖子的环氧树脂层排出压力。

公开(公告)号：US20050161784A1

公开(公告)日：2005-07-28

申请号：US11005868

申请日：2004-12-06

申请人： Anthony Chiu ,  Harry Siegel

发明人： Anthony Chiu ,  Harry Siegel

IPC分类号： G06K9/00 ,  H01L29/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： G06K9/0002

摘要： A flat filter layer is received between upper and lower mold portions of a mold for packaging an integrated circuit sensor device, held by the mold over and in contact with the integrated circuit's sensing surface, in light compression between the sensing surface and a mold surface. The filter layer includes slots allowing passage of injected encapsulating material to cover the integrated circuit die, with overlap portions embedded in the encapsulating material, while preventing such encapsulating material from flowing onto the sensing surface. The filter layer may be, for example, a liquid and/or light filter, and may include a protective or supportive backing. The filter is thus affixed to the packaged integrated circuit sensor device, while mold residue is reduced and mold life extended.

摘要翻译： 在模具的上模具部分和下模具部分之间容纳平坦的过滤层，用于将由模具保持的集成电路传感器装置封装在集成电路的感测表面上并与集成电路的感测表面接触，以在感测表面和模具表面之间的轻压缩。 过滤层包括允许注入的封装材料通过以覆盖集成电路管芯的槽，其中重叠部分嵌入在封装材料中，同时防止这种封装材料流入感测表面。 过滤层可以是例如液体和/或光过滤器，并且可以包括保护性或支撑性背衬。 因此，过滤器被固定到封装的集成电路传感器装置上，同时减少了模具残渣并延长了模具寿命。