公开(公告)号：US20240147633A1

公开(公告)日：2024-05-02

申请号：US18548516

申请日：2022-09-09

申请人： DAIWA CO., LTD.

发明人： Eiji YOSHIMURA

IPC分类号： H05K3/46 ,  H05K1/18

CPC分类号： H05K3/4644 ,  H05K1/185 ,  H05K1/0366 ,  H05K2203/068

摘要： A method for manufacturing a wiring board or a wiring board material includes: obtaining a laminated body LB including the wiring board or the wiring board material having an opening, an embedded member 14 positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin 17, the thermosetting resin 17 being filled between an inner surface of the opening of the wiring board or the wiring board material and the embedded member; and removing the cured product of the filling sheet or the coating layer by grinding to obtain a constant thickness of the laminated body.

公开(公告)号：US11490522B2

公开(公告)日：2022-11-01

申请号：US16078504

申请日：2017-02-17

申请人： DAIWA CO., LTD.

发明人： Yoshimura Eiji

IPC分类号： H05K3/02 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/26

摘要： Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.
The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

公开(公告)号：US20210195755A1

公开(公告)日：2021-06-24

申请号：US16078504

申请日：2017-02-17

申请人： DAIWA CO., LTD.

发明人： YOSHIMURA Eiji

IPC分类号： H05K3/02 ,  H05K3/00 ,  H05K3/26 ,  H05K3/40 ,  H05K1/11

摘要： Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.
The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

公开(公告)号：US20140134387A1

公开(公告)日：2014-05-15

申请号：US14158288

申请日：2014-01-17

申请人： DAIWA CO., LTD. ,  SHOUEI CO., LTD. ,  YACHIYO CO., LTD.

发明人： Kohei Yamada ,  Mitsuo Hori

IPC分类号： D06N7/00

CPC分类号： D06N7/0071 ,  A47G27/0212 ,  B32B5/18 ,  B32B5/245 ,  B32B2307/102 ,  B32B2307/20 ,  B32B2471/04 ,  B60N3/048 ,  D06M11/83 ,  D06N3/0059 ,  D06N3/0063 ,  D06N7/0065 ,  D06N7/0068 ,  D06N2209/025 ,  D06N2209/048 ,  D06N2209/101 ,  D06N2209/165 ,  D06N2209/1671 ,  Y10T428/23979 ,  Y10T428/23986 ,  Y10T428/23993

摘要： Provided is a mat which is capable of significantly contributing to sound and healthy life environment, and particularly capable of effectively reducing energy of electromagnetic waves, vibrations, sounds, impacts, radiations and so on and which has excellent antibacterial properties, antiviral properties, anti-allergen properties and deoderization properties.The mat (11) is a mat with a backing layer (13) formed on the back surface side of a fiber surface layer (12), wherein at least one of the fiber surface layer (12) and the backing layer (13) contains an organic attenuating filler (marked as ), a radiation reduction filler (marked as ), an iodine-based compound (marked as Δ) and an allergen reduction filler (marked as Δ).

摘要翻译： 提供了能够显着促进健康和健康生活环境的垫子，特别是能够有效地减少电磁波，振动，声音，冲击，辐射等的能量，并且具有优异的抗菌性，抗病毒性， 过敏原性质和脱色性质。 垫（11）是在纤维表面层（12）的背面侧上形成有背衬层（13）的垫，其中纤维表面层（12）和背衬层（13）中的至少一个含有 有机减毒填料（标记为），辐射降低填料（标记为），碘基化合物（标记为＆Dgr）和变应原还原填料（标记为＆Dgr）。