-
1.发明授权Terminal frame used to manufacture electronic devices and manufacturing system of terminal frames 失效端子架用于制造电子设备和终端机架的制造系统
公开(公告)号：US5859400A
公开(公告)日：1999-01-12
申请号：US739280
申请日：1996-10-29
CPC分类号： B23K11/004 , B23K37/0426 , B23K2201/38
摘要： A terminal frame used to manufacture electronic devices, the terminal frame having a metal strip and a plurality of stick-like metal terminals. The metal terminals are joined to the metal strip by resistance welding. A manufacturing system of such terminal frames includes a device used for resistance welding, where the device has an electrode which holds each terminal at a portion near a joint portion, and a current is supplied to the terminal through the electrode.
摘要翻译： 一种用于制造电子设备的终端框架，该终端框架具有金属条和多个棒状金属端子。 金属端子通过电阻焊接接合到金属带。 这种端子框架的制造系统包括用于电阻焊接的装置，其中该装置具有将每个端子保持在接合部分附近的部分的电极，并且通过电极将电流提供给端子。
-
公开(公告)号：US5596244A
公开(公告)日：1997-01-21
申请号：US502316
申请日：1995-07-13
CPC分类号： H03H9/177 , H03H9/0528 , H03H9/0547 , H03B5/32
摘要： A composite electronic component including a resonator element and a capacitor element fixed together by adhesive material. The capacitor element is longer than the resonator element, so that side steps are defined on both end portions of the elements. First and second lead terminals are connected by solder with first and second capacitor electrodes located on a front surface of the capacitor element and with resonator electrodes located on side surfaces of the resonator element exposed at the side steps. A third lead terminal is connected by solder with a third capacitor electrode located on a rear surface of the capacitor element. Therefore, the thin and miniature composite electronic component adapted for a Colpitts oscillation circuit is obtained at a low cost.
摘要翻译： 一种复合电子元件，包括由粘合剂材料固定在一起的谐振元件和电容器元件。 电容器元件比谐振器元件长，从而在元件的两个端部上限定侧边台阶。 第一引线端子和第二引线端子通过焊料连接，第一和第二电容器电极位于电容器元件的前表面上，并且谐振器电极位于谐振器元件的侧面暴露的侧表面。 第三引线端子通过焊料与位于电容器元件的后表面上的第三电容器电极连接。 因此，以低成本获得适用于Colpitts振荡电路的薄型和微型复合电子部件。
-
3.发明授权Method of manufacturing piezoelectric-resonator having vibrating spaces formed therein 失效制造其中形成有振动空间的压电谐振器的方法
公开(公告)号：US5410789A
公开(公告)日：1995-05-02
申请号：US150848
申请日：1993-11-12
申请人： Kazuyuki Noto , Jiro Miyazaki , Taketoshi Hino , Daisaku Kugou
发明人： Kazuyuki Noto , Jiro Miyazaki , Taketoshi Hino , Daisaku Kugou
CPC分类号： H03H9/1035 , H03H3/02 , Y10T29/42
摘要： In a chip-type piezoelectric-resonator, which is protected with thermosetting resin, mother sheets are bonded to cover both major surfaces of a mother substrate having a plurality of piezoelectric resonance elements which are provided on a piezoelectric substrate, in order to properly form vibrating spaces. The mother sheets are provided with concave portions for defining cavities for vibration. Then, protective resin is applied to cover the mother substrate which is bonded with the mother sheets, and thereafter the mother substrate is divided so as to obtain a plurality of chip-type piezoelectric-resonators.
摘要翻译： 在用热固性树脂保护的片式压电谐振器中，母片被接合以覆盖具有设置在压电基板上的多个压电谐振元件的母基板的主表面，以便适当地形成振动 空格 母片设置有用于限定振动腔的凹部。 然后，施加保护树脂以覆盖与母片接合的母基板，然后分割母基板，以获得多个芯片型压电谐振器。
-
-
搜索结果
3 条记录 (耗时 0.009 秒)