公开(公告)号：US6143639A

公开(公告)日：2000-11-07

申请号：US429877

申请日：1999-10-29

Applicant: Curtis M. Medlen ,  Mark E. Tuttle

Inventor： Curtis M. Medlen ,  Mark E. Tuttle

IPC: B23K20/02 ,  B23K20/16 ,  H01L21/60 ,  H05K3/32 ,  H01L21/50 ,  H01L21/44 ,  H01L23/48 ,  B23K20/00 ,  B23K20/12

CPC classification number: H01L24/12 ,  B23K20/02 ,  B23K20/16 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/321 ,  B23K2201/38 ,  B23K2201/42 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/10992

Abstract: Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

公开(公告)号：US6102276A

公开(公告)日：2000-08-15

申请号：US432164

申请日：1999-11-02

Applicant: Kazuhiko Takada

Inventor： Kazuhiko Takada

IPC: H01R13/24 ,  B23K20/02 ,  H01B13/012 ,  H01R43/01 ,  H01R43/02 ,  B23K20/12 ,  B23K31/00

CPC classification number: H01R43/01 ,  B23K20/02 ,  B23K20/023 ,  H01R43/02 ,  B23K2201/38 ,  Y10T29/49174 ,  Y10T29/49181 ,  Y10T29/53235

Abstract: Electric wires of a double-sided solderless connector are pressure-welded. The method of the pressure-welding includes the steps of: locating a pressure welding blade and support blade on both sides of a double-sided solderless connector, in a face to face relationship, so as to be movable in vertical direction; supporting one side of said double-sided solderless connector with said support blade; and pressure-welding respective electric wires to terminals at the other side of said double-sided solderless connector with said pressure welding blade.

Abstract translation: 双面无焊接连接器的电线被压焊。 压焊方法包括以下步骤：在双面无焊接连接器的两侧以面对面的关系定位压焊刀片和支撑刀片，以便能够在垂直方向上移动; 将所述双面无焊接连接器的一侧支撑在所述支撑刀片上; 并将各个电线压接在所述双面无焊接连接器的与所述压焊刀片的另一侧的端子处。

公开(公告)号：US06064026A

公开(公告)日：2000-05-16

申请号：US187150

申请日：1998-11-06

Applicant: William J. Tkazyik ,  Thaddeus Grabowski ,  Anthony Tolla ,  Gregory Sterc

Inventor： William J. Tkazyik ,  Thaddeus Grabowski ,  Anthony Tolla ,  Gregory Sterc

IPC: B23K1/00 ,  B23K11/00 ,  H01R43/02 ,  B23K11/14 ,  B23K11/16

CPC classification number: H01R43/0263 ,  B23K1/0004 ,  B23K11/002 ,  H01R43/0214 ,  B23K2201/38

Abstract: A method for producing an electrical bond between a contact element of an electrical connector and a conductor, the contact element having a portion that is bifurcated such that the conductor is positioned between the furcations, the method comprising the steps of (a) providing a system comprising a power source and a weld head, the weld head having a first input and a second input for connection to a first polarity output and a second polarity output, respectively, of the power source, the system further including first and second electrodes movably attached to the weld head and electrically connected to the first and second inputs, respectively, (b) positioning the electrodes on the weld head to create a space between the electrodes that is sized for receiving both furcations of each contact element, (c) moving the weld head toward the furcations to effect contact between the first electrode and one of the furcations and between the second electrode and the other furcation, the contact being made at a predetermined force that causes the furcations to bend toward each other, and (d) allowing a current of a predetermined magnitude to flow through (i) the first input, (ii) the first electrode, (iii) the furcation in contact with the first electrode, (iv) the conductor, (v) the furcation in contact with the second electrode, (vi) the second electrode and (vii) the second input.

Abstract translation: 一种用于在电连接器的接触元件和导体之间产生电接合的方法，所述接触元件具有分叉的部分，使得所述导体位于所述分叉之间，所述方法包括以下步骤：（a）提供系统 包括电源和焊接头，所述焊头具有分别连接到所述电源的第一极性输出和第二极性输出的第一输入和第二输入，所述系统还包括可移动地连接的第一和第二电极 （b）将电极定位在焊接头上以在电极之间形成一个尺寸适于接收每个接触元件的两个分叉的空间，（c）将电极移动到焊接头，并且电连接到第一和第二输入端 焊接头朝向分叉处以实现第一电极与分叉之间以及第二电极与另一分叉之间的接触， ct以预定的力制成，导致分叉朝向彼此弯曲，以及（d）允许预定大小的电流流过（i）第一输入，（ii）第一电极，（iii）分叉 与第一电极接触，（iv）导体，（v）与第二电极接触的分叉，（vi）第二电极和（vii）第二输入端。

公开(公告)号：US6042932A

公开(公告)日：2000-03-28

申请号：US64556

申请日：1998-04-22

Applicant: Gerald Ingles ,  Raymond Simons ,  Suellyn Collins ,  Mario Garritano

Inventor： Gerald Ingles ,  Raymond Simons ,  Suellyn Collins ,  Mario Garritano

IPC: B23K1/00 ,  H01R4/02 ,  H05B3/34 ,  H05B3/84 ,  B32B3/00 ,  B23K101/38

CPC classification number: H01R4/024 ,  B23K1/0008 ,  B23K2201/38 ,  H01R2201/26 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A flexible buss bar adapted for electrical connection with circuitry carried by a glass pane is provided, as well as a method of attaching a flexible buss bar to a glass pane. The flexible buss bar includes a flexible conductor having at least one metallic contact pad affixed thereto. It is also contemplated to have a plurality of such metallic contact pads attached at regular intervals along the length of the flexible conductor. The spacing of the plurality of metallic contact pads is selected to match the locations of corresponding structures formed on the glass pane. Solder cladding is selectively adhered to portions of the at least one metallic contact such that the at least one metallic contact pad may be bonded to the corresponding structure located on the glass pane. The method of connecting a flexible buss bar to an electrical contact pad formed on the surface of a glass pane includes the steps of providing a flexible buss bar, providing at least one metallic contact element, and selectively cladding a portion of the metallic contact element with a solderable material having a relatively low melting point. The metallic contact element is then affixed to the flexible buss bar, and the flexible buss bar is placed against the glass pane with the metallic contact element in physical contact with the contact pad formed on the glass pane. The solder cladding is then re-flowed to bond the metallic contact element attached to the flexible conductor to the electrical contact pad formed on the glass pane.

Abstract translation: 提供一种适于与由玻璃板承载的电路电连接的柔性总线杆，以及将柔性总线连接到玻璃板的方法。 柔性总线杆包括具有固定到其上的至少一个金属接触垫的柔性导体。 还可以设想具有沿着柔性导体的长度以规则间隔连接的多个这样的金属接触垫。 选择多个金属接触垫的间隔以匹配形成在玻璃板上的相应结构的位置。 选择性地将焊料包层粘附到至少一个金属接触件的部分，使得至少一个金属接触垫可以结合到位于玻璃板上的相应结构。 将柔性总线连接到形成在玻璃板表面上的电接触焊盘的方法包括以下步骤：提供柔性总线杆，提供至少一个金属接触元件，并且选择性地将金属接触元件的一部分覆盖 具有较低熔点的可焊材料。 然后将金属接触元件固定到柔性总线杆上，并且将柔性总线杆抵靠玻璃板放置，金属接触元件与形成在玻璃板上的接触焊盘物理接触。 焊料包层然后被重新流动，以将附接到柔性导体的金属接触元件接合到形成在玻璃板上的电接触焊盘。

公开(公告)号：US4558200A

公开(公告)日：1985-12-10

申请号：US522444

申请日：1983-08-12

Applicant: Charles H. Weigand, Jr.

Inventor： Charles H. Weigand, Jr.

IPC: B23K3/03 ,  B23K3/08 ,  B23K1/12

CPC classification number: B23K3/08 ,  B23K3/0307 ,  B23K2201/38

Abstract: A method of attaching fine coil wire ends 22, 24 to terminal connectors 16, 18 wherein the terminals are rapidly heated into the red zone by common current flow therethrough from contact electrodes 26, 28 in the presence of a gaseous purge comprising a mixture of hydrogen balance argon, nitrogen, or helium while low melting temperature solder 84 is flowed onto the heated terminal for wire attachment. The gaseous purge from a nozzle 80 is maintained until the terminal has cooled sufficiently to prevent rapid atmosphere oxidation thereof.

Abstract translation: 将细线圈线端22,24附接到端子连接器16,18的方法，其中在气态吹扫的存在下，通过从接触电极26,28流出的共同电流，端子被快速加热到红色区域中，该气体吹扫包括氢气混合物 平衡氩气，氮气或氦气，同时低熔点焊料84流到被加热的端子上用于电线连接。 保持来自喷嘴80的气体吹扫，直到端子充分冷却，以防止其快速气氛氧化。

公开(公告)号：US4320281A

公开(公告)日：1982-03-16

申请号：US174052

申请日：1980-07-31

Applicant: David G. Cruickshank ,  Robert Webb

Inventor： David G. Cruickshank ,  Robert Webb

IPC: B23K1/005 ,  H01G2/14 ,  H01G4/228 ,  B23K27/00

CPC classification number: H01G4/228 ,  B23K1/0056 ,  H01G2/14 ,  B23K2201/38

Abstract: Electrically conductive leads (12) are bonded to pre-tinned ends (11) of a thin film, rolled capacitor (10). A dimple (20) is formed in the leads (12) resulting in an indentation (21) therein and a protrusion (22) on the opposite surface thereof. The protrusion (22) is placed in contact with the end (11) and a pulsed laser beam directed into the indentation (21) to heat the lead (12) in the vicinity of the protrusion (22) to reflow a portion of the pre-tinned ends (11) to form a bond therebetween.

Abstract translation: 导电引线（12）接合到薄膜，卷绕电容器（10）的预镀锡端（11）。 在引线（12）中形成凹坑（20），导致凹陷（21）和在其相对表面上的突起（22）。 突起（22）被放置成与端部（11）接触，并且脉冲激光束被引导到凹部（21）中，以在突起（22）附近加热引线（12）以回流预先的一部分 （11）以在它们之间形成结合。

公开(公告)号：US3402758A

公开(公告)日：1968-09-24

申请号：US55613366

申请日：1966-06-08

Applicant: WESTERN ELECTRIC CO

Inventor： CUSHMAN ROBERT H

IPC: B22D17/00 ,  B22D19/04 ,  B22D19/14 ,  B23K1/00 ,  H01R4/02

CPC classification number: H01R4/021 ,  B22D17/00 ,  B22D19/04 ,  B22D19/14 ,  B23K1/00 ,  B23K2201/38 ,  Y10T29/49176

公开(公告)号：US3393853A

公开(公告)日：1968-07-23

申请号：US48811365

申请日：1965-09-17

Applicant: WESTERN ELECTRIC CO

Inventor： DURR HELMUT E ,  RAUCH RICHARD G

IPC: B23K3/08 ,  H01R43/02

CPC classification number: B23K3/087 ,  B23K2201/38 ,  H01R43/0249

公开(公告)号：US6119926A

公开(公告)日：2000-09-19

申请号：US247325

申请日：1999-02-10

Applicant: Hans Egger ,  Marit Seidel ,  Daniel von Flue

Inventor： Hans Egger ,  Marit Seidel ,  Daniel von Flue

IPC: H01L21/60 ,  B23K20/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/38 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78901 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

Abstract: On the production of wire connections (wire bonding) which start from a semiconductor chip and end on a substrate (2b) the capillary (12) guiding the wire (3) should be moved to an end section (s3) of its trajectory in a specific, programmed way in order to eliminate as far as possible reactions on the geometry of the wire bridge on bonding of the wire to the substrate and to produce flawless bond connections. The end section (s3) in which the capillary (12) moves slowly begins at a predetermined height (H) and ends on the substrate at the second connection point (5). In the end section (s3) the downward movement (vv) of the capillary is superimposed by a horizontal movement (vh) which is directed away from the already existing connection of the wire (3) to the chip and which continually decreases in relationship to the downward movement (vv).

Abstract translation: 在从半导体芯片开始并且在基板（2b）上的端部的线连接（引线接合）的生产中，引导线（3）的毛细管（12）应当被移动到其轨迹的端部（s3） 具体的，编程的方式，以便尽可能地消除尽可能地在将线接合到衬底上时对线桥的几何形状的反应，并且产生无瑕疵的接合连接。 毛细管（12）缓慢移动的端部（s3）在预定高度（H）开始，并在第二连接点（5）处终止在基板上。 在末端部分（s3）中，毛细管的向下运动（vv）通过水平运动（vh）叠加，水平运动（vh）指向远离已经存在的导线（3）的连接到芯片，并且其相对于 向下运动（vv）。

公开(公告)号：US6095399A

公开(公告)日：2000-08-01

申请号：US432169

申请日：1999-11-02

Applicant: Kazuhiko Takada

Inventor： Kazuhiko Takada

IPC: H01R13/24 ,  B23K20/02 ,  H01B13/012 ,  H01R43/01 ,  H01R43/02 ,  B23K3/03 ,  B23K37/00

CPC classification number: H01R43/01 ,  B23K20/02 ,  B23K20/023 ,  H01R43/02 ,  B23K2201/38 ,  Y10T29/49174 ,  Y10T29/49181 ,  Y10T29/53235

Abstract: A pressure welding apparatus for pressure-welding an electric wire quickly and surely to a pressure welding terminal in a double-sided solderless connector according to various wire-diameters. A plurality of applicators having various wire pressure welding blades and connector support blades are arranged radially and rotatively around a rotary shaft for enabling to select the pressure welding blade and the support blade by rotary operation of the applicator. A plurality of applicators are arranged symmetrically with respect to the double-sided solderless connector. The pressure welding blade and the support blade with a mechanism movable in up and down directions are arranged opposite to each other on both sides of the solderless connector for enabling to pressure-weld an electric wire to one side of the solderless connector by the pressure welding blade, while the other side of the solderless connector is supported by the support blade. At the pressure welding, a pair of vertically movable wire guides arranged on both sides of the pressure welding blade are closely located on both sides of the pressure welding terminal on a bottom wall of the solderless cornector, also making the ends thereof contact with the bottom wall.

Abstract translation: 一种用于根据各种线径对双面无焊接连接器中的电焊丝快速且可靠地对焊接端子进行压焊的压焊装置。 具有各种线压焊接刀片和连接器支撑刀片的多个施加器径向和可旋转地布置在旋转轴周围，以便通过旋转操作施加器来选择压焊刀片和支撑刀片。 多个施加器相对于双面无焊接连接器对称地布置。 压焊刀片和具有可沿上下方向移动的机构的支撑刀片在无焊接连接器的两侧彼此相对布置，以便能够通过压焊将电线对无焊接连接器的一侧进行加压焊 而无焊接连接器的另一侧由支撑刀片支撑。 在压力焊接时，布置在压焊刀片两侧的一对垂直可动导线器位于无焊接转角器的底壁上的压焊端子的两侧，并且其端部与底部接触 壁。