Polyester Resin Compositions With Reduced Emission Of Volatile Organic Compounds
    2.
    发明申请
    Polyester Resin Compositions With Reduced Emission Of Volatile Organic Compounds 审中-公开
    具有减少挥发性有机化合物排放的聚酯树脂组合物

    公开(公告)号:US20080125565A1

    公开(公告)日:2008-05-29

    申请号:US11658276

    申请日:2005-07-13

    IPC分类号: C08G18/81

    摘要: Thermally curate resin composition, having shrink-controlled properties and being suitable for use in sheet moulding compounds and bulk moulding compounds (SMCs and BMCs) comprising, inter alia (a) an unsaturated polyester; (b) an alkenyl aromatic monomer; (c) a low profile additive; (d) a peroxide initiator; (e) a thickening agent; (f) fibrous reinforcement material; and optionally one or more components selected from the group of (g) mould release agents; (h) wetting and viscosity reducing agents; and (i) fillers, wherein the composition also comprises a uret dione diisocyanate, in an amount of at least 0.2-1.0% by weight relative to the total weight of components (a), (b) and (c) of the resin composition. The resin compositions according to the invention in particular have a low emission of volatile organic compounds (VOC). More particularly, the resin compositions have excellent Class A properties. The present invention also relates to low profile additives (LPAs) wherein a uret dione diisocyanate is chemically attached through one or both of its reactive side-chain isocyanate groups to one or more of the OH—, NH2—, or COOH— groups of a component already having LPA properties. Finally, the present invention relates to low-VOC products and parts produced from the SMCs and BMCs according to the invention.

    摘要翻译: 热固化树脂组合物,具有收缩控制性能并且适用于片状模塑化合物和大量模塑化合物(SMC和BMC),其包括(a)不饱和聚酯; (b)链烯基芳族单体; (c)低调添加剂; (d)过氧化物引发剂; (e)增稠剂; (f)纤维增强材料; 和任选的一种或多种选自(g)脱模剂的组分; (h)润湿和粘度降低剂; 和(i)填料,其中所述组合物还包含脲二酮二异氰酸酯,其量相对于树脂组合物的组分(a),(b)和(c)的总重量的至少0.2-1.0重量% 。 根据本发明的树脂组合物特别具有低挥发性有机化合物(VOC)的排放。 更具体地说,树脂组合物具有优异的A类特性。 本发明还涉及低分子添加剂(LPA),其中脲二酮二异氰酸酯通过其一个或两个反应性侧链异氰酸酯基化学连接到一个或多个OH - ,NH 2 - - 或已经具有LPA性质的组分的COOH-基团。 最后,本发明涉及低VOC产品和由根据本发明的SMC和BMC生产的部件。