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1.发明授权公开(公告)号：US12098230B2
公开(公告)日：2024-09-24
申请号：US18523968
申请日：2023-11-30
发明人： De Wu , Yi Wang , Shuhang Liao , Junxing Su
IPC分类号： C08J5/18 , C08F283/00 , C08F283/04 , C08G73/12 , C08K3/36 , H05K3/22
CPC分类号： C08F283/00 , C08F283/045 , C08G73/12 , C08J5/18 , C08K3/36 , H05K3/22 , C08J2351/08
摘要： A build-up film with low dielectric loss, a preparation method therefor, and a circuit substrate structure are provided. The build-up film is prepared from raw materials including 5-10 parts by mass of monofunctional benzoxazine having indene oligomer, 40-65 parts by mass of polymerized aromatic-based maleimide, 30-50 parts by mass of allyl benzoxazine, 0.1-3 parts by mass of initiator, 250-400 parts by mass of inorganic filler, and 0.1-5 parts by mass of silane coupling agent. The build-up film has low dielectric loss and high tensile strength. Low dielectric loss enables it to be applied in the field of 5G. For example, the build-up film can be used to packaging integrated circuit substrates, which is conducive to minimizing the transmission loss.
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公开(公告)号：US12091510B2
公开(公告)日：2024-09-17
申请号：US16764831
申请日：2019-04-09
申请人： LG CHEM, LTD.
发明人： Changbo Shim , Hyunsung Min , Hee Yong Shim , Hwayeon Moon , Seunghyun Song
IPC分类号： C08G59/56 , B32B5/26 , B32B7/027 , B32B7/12 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/38 , C08G59/68 , C08G73/12 , C08J5/24 , C08K3/36 , C08K5/5419 , C08K5/544 , C08K9/06 , C08L33/08 , C08L63/00 , C08L79/08 , H01L23/00 , H01L23/14 , H05K1/02 , H05K1/03
CPC分类号： C08G73/12 , B32B5/26 , B32B7/027 , B32B7/12 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/38 , C08G59/56 , C08G59/686 , C08J5/244 , C08J5/249 , C08K3/36 , C08K5/5419 , C08K9/06 , C08L33/08 , C08L63/00 , C08L79/08 , H01L23/145 , H01L23/562 , H05K1/0271 , H05K1/0373 , B32B2250/40 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/734 , B32B2457/00 , B32B2457/14 , C08J2363/00 , C08J2433/08 , C08J2479/08 , C08K2201/003 , C08K2201/014 , C08L2205/025 , C08L2205/035 , H05K2201/068
摘要： The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.
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公开(公告)号：US20240301115A1
公开(公告)日：2024-09-12
申请号：US18570237
申请日：2022-06-22
发明人： Keita IMAI , Akihiko OTOGURO , Kazuya NAKASHIMA
IPC分类号： C08F290/14 , C08F222/32 , C08G73/10 , C08G73/12 , G03F7/038
CPC分类号： C08F290/145 , C08F222/32 , C08G73/1067 , C08G73/12 , G03F7/0387
摘要： A negative-type photosensitive polymer of the present invention is a solvent-soluble negative-type photosensitive polymer which has a structural unit containing an imide ring, the negative-type photosensitive polymer containing a group having a terminal double bond, in which an average value of positive electric charges (δ+) of two carbonyl carbons of the imide ring is equal to or less than 0.099 as calculated by a charge equilibration method.
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公开(公告)号：US20240166818A1
公开(公告)日：2024-05-23
申请号：US18546729
申请日：2022-02-11
发明人： Dipankar Basak , Chinmay Nardele , Rahul Shingte , Mattia Bassi
摘要： The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.
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公开(公告)号：US11939428B2
公开(公告)日：2024-03-26
申请号：US17391298
申请日：2021-08-02
发明人： Binod B. De , Sanjay Malik , William A. Reinerth , Ognian N. Dimov , Ahmad A. Naiini , Raj Sakamuri
CPC分类号： C08G73/1067 , C08G73/1085 , C08G73/12 , C08L79/08 , H01L23/29 , C08L2203/16 , C08L2203/202 , C08L2203/204 , C08L2203/206 , C08L2312/06
摘要： This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),
(b) at least one diamine of Structure (II),
(c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.-
公开(公告)号：US20230399467A1
公开(公告)日：2023-12-14
申请号：US18203792
申请日：2023-05-31
CPC分类号： C08G73/12 , C08K5/541 , C08L79/085 , C08G2190/00 , C08L2203/16
摘要： Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains:
(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule;
(B) a reaction initiator; and
(C) an inorganic filler surface-treated with a silane coupling agent,
wherein the component (C) has a maximum particle size of not larger than 40 μm.-
公开(公告)号：US09828468B2
公开(公告)日：2017-11-28
申请号：US14779189
申请日：2014-03-12
IPC分类号： C08F2/00 , C08F26/02 , C08F126/06 , C08F226/06 , C08F22/40 , C08F26/06 , C08F122/40 , C08F222/40 , C08F2/08 , C08G73/10 , C08G73/12 , C08L79/08
CPC分类号： C08G73/10 , C08F222/40 , C08G73/12 , C08K5/13 , C08L79/08 , C08L79/085
摘要： The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.
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公开(公告)号：US20170288261A1
公开(公告)日：2017-10-05
申请号：US15627240
申请日：2017-06-19
发明人： Xiang-Ming He , Guan-Nan Qian , Yu-Ming Shang , Jian-Jun Li , Li Wang , Ju-Ping Yang , Jian Gao , Peng Zhao , Yao-Wu Wang
IPC分类号： H01M10/0525 , H01M4/04 , H01M4/60 , H01M4/36 , H01M4/583
CPC分类号： H01M10/0525 , C08G73/00 , C08G73/12 , H01M4/0404 , H01M4/0471 , H01M4/133 , H01M4/1393 , H01M4/362 , H01M4/583 , H01M4/602 , H01M4/628 , H01M2004/027
摘要： An anode composite material includes an anode active material and a polymer composited with the anode active material. The polymer is obtained by polymerizing a maleimide type monomer with an organic diamine type compound. The maleimide type monomer is a maleimide monomer, a bismaleimide monomer, a multimaleimide monomer, a maleimide type derivative monomer, or combinations thereof. A method for forming the anode composite material and a lithium ion battery are also disclosed.
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公开(公告)号：US20170210855A1
公开(公告)日：2017-07-27
申请号：US15081810
申请日：2016-03-25
申请人： National Taiwan University of Science and Technology , Industrial Technology Research Institute
发明人： Fu-Ming Wang , Bing-Joe Hwang , Chorng-Shyan Chern , Jung-Mu Hsu , Jing-Pin Pan , Chang-Rung Yang
IPC分类号： C08G75/28 , H01M10/0567 , H01M4/13 , H01M10/0525
CPC分类号： C08G75/28 , C08G73/00 , C08G73/12 , H01M4/13 , H01M4/62 , H01M10/052 , H01M10/0525 , H01M10/0567 , H01M2004/028
摘要： An oligomer additive is provided. The oligomer additive is obtained by a reaction of a maleimide, a barbituric acid and a dibenzyl trithiocarbonate. A lithium battery including an anode, a cathode, a separator, an electrolyte solution and a package structure is also provided, wherein the cathode includes the oligomer additive.
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公开(公告)号：US08748519B2
公开(公告)日：2014-06-10
申请号：US12945353
申请日：2010-11-12
申请人： Girish N. Deshpande
发明人： Girish N. Deshpande
IPC分类号： C07D209/48
CPC分类号： C08G63/91 , C08G63/6856 , C08G63/916 , C08G73/0672 , C08G73/10 , C08G73/12 , C08K3/013 , C08K5/0041 , C08L79/08 , Y10T428/1352
摘要： The disclosure relates to oxygen scavenging polymer compositions, methods of making the compositions, articles prepared from the compositions, and methods of making the articles. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
摘要翻译： 本公开涉及除氧聚合物组合物，制备组合物的方法，由组合物制备的制品以及制备制品的方法。 该摘要旨在作为用于在特定技术中进行搜索的扫描工具，而不意在限制本发明。
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