公开(公告)号：US20190010343A1

公开(公告)日：2019-01-10

申请号：US15754086

申请日：2016-09-02

申请人： CARBON3D, INC.

发明人： Matthew S. Menyo ,  Jason P. Rolland

IPC分类号： C09D11/102 ,  C09D11/101 ,  C09D11/037 ,  C08G73/06 ,  C08K3/22 ,  C08K3/04 ,  B29C64/277 ,  B33Y70/00 ,  B33Y10/00

CPC分类号： B29C64/124 ,  B29C64/277 ,  B29C71/02 ,  B29C71/04 ,  B29K2039/00 ,  B29K2079/00 ,  B33Y10/00 ,  B33Y70/00 ,  C08G73/0655 ,  C08G73/0661 ,  C08L61/14 ,  C08L33/14

摘要： A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.

公开(公告)号：US09910354B2

公开(公告)日：2018-03-06

申请号：US15305793

申请日：2015-04-14

申请人： NISSAN CHEMICAL INDUSTRIES, LTD.

发明人： Yasushi Sakaida ,  Tokio Nishita ,  Noriaki Fujitani ,  Rikimaru Sakamoto

IPC分类号： G03F7/11 ,  G03F7/20 ,  G03F7/26 ,  C09D179/08 ,  G03F7/004 ,  G03F7/16 ,  H01L21/308

CPC分类号： G03F7/11 ,  C08G73/0616 ,  C08G73/0633 ,  C08G73/0644 ,  C08G73/0655 ,  C09D179/04 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/094 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/2006 ,  G03F7/2037 ,  G03F7/26 ,  H01L21/3081 ,  H01L21/3086

摘要： A composition for forming a resist underlayer film which make possible to form a desired high-adhesion resist pattern. A resist underlayer film-forming composition for lithography containing a polymer having the following structure Formula (1) or (2) at a terminal of a polymer chain, crosslinker, compound promoting crosslinking reaction, and organic solvent. (wherein R1 is a C1-6 alkyl group optionally having a substituent, phenyl group, pyridyl group, halogeno group, or hydroxy group, R2 is a hydrogen atom, a C1-6 alkyl group, hydroxy group, halogeno group, or ester group of —C(═O)O—X wherein X is a C1-6 alkyl group optionally having a substituent, R3 is a hydrogen atom, a C1-6 alkyl group, hydroxy group, or halogeno group, R4 is a direct bond or divalent C1-8 organic group, R5 is a divalent C1-8 organic group, A is an aromatic ring or heteroaromatic ring, t is 0 or 1, and u is 1 or 2.)

公开(公告)号：US09834638B2

公开(公告)日：2017-12-05

申请号：US12132722

申请日：2008-06-04

申请人： David F. Sounik ,  Steven L. Schilling ,  Don S. Wardius ,  Edward E. Ball

发明人： David F. Sounik ,  Steven L. Schilling ,  Don S. Wardius ,  Edward E. Ball

IPC分类号： C08G18/02 ,  C08G18/48 ,  C08G18/09 ,  C08G73/06 ,  C08J9/14 ,  C08G101/00

CPC分类号： C08G18/4891 ,  C08G18/092 ,  C08G18/4804 ,  C08G73/0655 ,  C08G2101/0025 ,  C08G2101/005 ,  C08G2101/0058 ,  C08G2105/02 ,  C08J9/141 ,  C08J2205/10 ,  C08J2375/04

摘要： The present invention provides a process for producing a rigid polyisocyanurate foam involving reacting at an isocyanate index of from about 175 to about 400, a polyisocyanate with at least one natural-oil polyol containing at least about 35 wt. %, based on the weight of the polyol, of natural oil, having a hydroxyl number from about 175 to about 375 and a hydroxyl functionality of about 2.0 to about 2.8, in the presence of a blowing agent and optionally, in the presence of one or more of surfactants, flame retardants, pigments, catalysts and fillers, wherein the resulting foam has a renewable biobased content of at least 8% by weight. The foams provided by the inventive process possess properties similar to foams produced from petroleum-derived materials and may find use in wall or roof insulation systems. The high biobased content (>8%) may allow wall or roof insulation systems containing these foams to be considered for the U.S. Government's preferred procurement program.

公开(公告)号：US09775238B2

公开(公告)日：2017-09-26

申请号：US14356266

申请日：2012-10-26

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Daisuke Ueyama ,  Masanobu Sogame ,  Chisato Saito ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC分类号： H05K1/03 ,  C08J5/24 ,  C08G73/06 ,  C08G73/12 ,  C08L79/04 ,  C09K5/14

CPC分类号： H05K1/0373 ,  C08G73/0655 ,  C08G73/12 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/04 ,  C08K2201/003 ,  C08L79/04 ,  C09K5/14 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/25 ,  Y10T442/2475 ,  C08L63/00 ,  C08L79/085

摘要： The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

公开(公告)号：US20170158854A1

公开(公告)日：2017-06-08

申请号：US15118302

申请日：2015-02-19

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Yoshitaka UENO ,  Masataka KUDO ,  Michio YAGINUMA

IPC分类号： C08L71/12 ,  C08J5/24 ,  B32B27/06 ,  H05K1/03 ,  B32B15/08 ,  B32B27/20

CPC分类号： C08L71/126 ,  B32B5/02 ,  B32B15/08 ,  B32B27/06 ,  B32B27/20 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  C08G73/0655 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/36 ,  C08K5/5399 ,  C08K7/18 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C08L2203/20 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209

摘要： A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

公开(公告)号：US20160115271A1

公开(公告)日：2016-04-28

申请号：US14784128

申请日：2014-06-16

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Masayuki KATAGIRI ,  Go HIGASHIHARA ,  Kenji ARII ,  Yuuichi SUGANO ,  Makoto TSUBUKU

IPC分类号： C08G10/04 ,  C08L71/00 ,  B32B27/28 ,  C09J161/18 ,  C09D161/18 ,  B32B15/08 ,  C08L63/00 ,  C08L61/18

CPC分类号： C08G10/04 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B27/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/00 ,  C08G14/12 ,  C08G73/0655 ,  C08J5/24 ,  C08J2361/34 ,  C08J2379/04 ,  C08L61/18 ,  C08L61/34 ,  C08L63/00 ,  C08L71/00 ,  C08L79/04 ,  C09D161/18 ,  C09D161/34 ,  C09D179/04 ,  C09J161/18 ,  C09J161/34 ,  C09J179/04 ,  H05K1/0326 ,  H05K1/0346

摘要： The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.

摘要翻译： 本发明的氰酸酯化合物通过将改性萘甲醛树脂进行氰化而得到。

公开(公告)号：US09169394B2

公开(公告)日：2015-10-27

申请号：US13577870

申请日：2011-02-09

申请人： Bee Eng Mary Chan ,  Wei Yuan ,  Junluo Feng ,  Zaher Judeh

发明人： Bee Eng Mary Chan ,  Wei Yuan ,  Junluo Feng ,  Zaher Judeh

IPC分类号： C08K3/04 ,  C08K7/00 ,  C08K9/04 ,  C08L79/08 ,  B82Y30/00 ,  C08G73/06 ,  C08G73/10 ,  C08G73/18 ,  C08J3/205 ,  C08L63/00 ,  C08L65/00 ,  C08L79/04 ,  H01B1/24 ,  C08K7/24 ,  C08L87/00

CPC分类号： C08L79/08 ,  B82Y30/00 ,  C08G73/0655 ,  C08G73/10 ,  C08G73/18 ,  C08G2261/3422 ,  C08J3/2053 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L51/00 ,  C08L63/00 ,  C08L65/00 ,  C08L79/04 ,  C08L79/085 ,  C08L87/005 ,  H01B1/24 ,  C08L2666/02

摘要： The present invention refers to a method of dispersing carbon nanotubes in a thermosetting resin. The method comprises: (a) contacting the carbon nanotubes with a dispersant in a solvent to form a dispersion mixture, wherein the dispersant is a graft polymer comprising a polymeric backbone and a side chain grafted to the polymeric backbone; and (b) adding the thermosetting resin to the dispersion solution to form a resin blend. The present invention also refers to a composition used for the method.

摘要翻译： 本发明涉及将碳纳米管分散在热固性树脂中的方法。 该方法包括：（a）使碳纳米管与分散剂在溶剂中接触以形成分散体混合物，其中分散剂是接枝聚合物，其包含聚合物骨架和接枝到聚合物骨架上的侧链; 和（b）将热固性树脂加入到分散液中以形成树脂共混物。 本发明还涉及用于该方法的组合物。

公开(公告)号：US09134609B2

公开(公告)日：2015-09-15

申请号：US14245184

申请日：2014-04-04

申请人： LG CHEM, LTD.

发明人： Se-Jin Ku ,  Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang Joo Lee ,  Min-Su Jeong

IPC分类号： C08F2/50 ,  B29C71/04 ,  A61L2/08 ,  A61L24/00 ,  C08F2/46 ,  C08G61/04 ,  G03F7/029 ,  C09D179/04 ,  C08G73/06 ,  G03F7/032

CPC分类号： G03F7/029 ,  C08G73/0644 ,  C08G73/065 ,  C08G73/0655 ,  C09D179/04 ,  G03F7/032 ,  C08L63/00

摘要： The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.

摘要翻译： 本发明涉及能够提供玻璃化转变温度高，耐热可靠性提高的干膜阻焊剂的光固化型和热固化性树脂组合物，以及干膜阻焊剂。 所述树脂组合物可以包括酸改性低聚物，其包含具有羧基（-COOH）和可光固化不饱和官能团的亚氨基碳酸酯基化合物，具有两个或更多个可光固化不饱和官能团的光聚合单体， 具有可热固化官能团的热固性粘合剂和光引发剂。

公开(公告)号：US09133339B2

公开(公告)日：2015-09-15

申请号：US14107585

申请日：2013-12-16

申请人： ELITE MATERIALS CO., LTD.

发明人： Chen-Yu Hsieh

IPC分类号： C08L79/00 ,  H05K1/03

CPC分类号： C08L79/00 ,  C08G73/0655 ,  C08L79/04 ,  H05K1/0353 ,  H05K2201/0209

摘要： A resin composition contains: (A) 100 parts by weight of the cyanate ester resin; (B) 5 to 80 parts by weight of the styrene-maleic anhydride copolymer; (C) 15 to 80 parts by weight of the styrene-butadiene-divinyl benzene (SBDVB) terpolymer; and (D) 5 to 60 parts by weight of the acrylate compound, where the contents of the styrene-maleic anhydride copolymer, the styrene butadiene divinyl benzene terpolymer, and the acrylate compound are based on 100 parts by weight of the cyanate ester resin. By providing such formulation, the resin composition of the present invention exhibits low dielectric constant, low dielectric dissipation, high thermal stability and high flame resistance, and is useful in manufacturing a prepreg or a resin film, and is further useful in manufacturing a laminate and a printed circuit board.

摘要翻译： 树脂组合物含有：（A）100重量份的氰酸酯树脂; （B）5〜80重量份苯乙烯 - 马来酸酐共聚物; （C）15〜80重量份苯乙烯 - 丁二烯 - 二乙烯基苯（SBDVB）三元共聚物; 和（D）5至60重量份的丙烯酸酯化合物，其中苯乙烯 - 马来酸酐共聚物，苯乙烯丁二烯二乙烯基苯三元共聚物和丙烯酸酯化合物的含量基于100重量份的氰酸酯树脂。 通过提供这样的配方，本发明的树脂组合物显示低介电常数，低介电耗散，高热稳定性和高阻燃性，并且可用于制备预浸料或树脂膜，并且还可用于制造层压板 印刷电路板。

公开(公告)号：US09090796B2

公开(公告)日：2015-07-28

申请号：US13671614

申请日：2012-11-08

申请人： Hitachi, Ltd.

发明人： Tomokazu Tanase ,  Hiroyuki Kagawa ,  Satoru Amou

IPC分类号： C08G73/06 ,  C08L79/04 ,  C09D167/00 ,  C08K5/17 ,  C08K3/34 ,  C09D7/12 ,  C09D179/04 ,  C08K9/04 ,  B82Y30/00 ,  H01B3/30 ,  C08K5/00

CPC分类号： C09D167/00 ,  B82Y30/00 ,  C08G73/0644 ,  C08G73/0655 ,  C08G73/0661 ,  C08K3/346 ,  C08K5/0091 ,  C08K5/17 ,  C08K9/04 ,  C09D7/62 ,  C09D7/70 ,  C09D179/04 ,  H01B3/303 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  C08L79/04 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.

摘要翻译： 本发明提供了具有优异的热稳定性，电绝缘性和粘合性的有机 - 无机复合材料。 有机无机复合材料包括由三嗪环组成的树脂，其通过热固化含有层间粘土矿物（经过层间改性的粘土）与氰酸酯化合物的固化催化剂和氰酸酯化合物的混合物的清漆 其中，所述粘土的量为氰酸酯化合物的0.1〜12重量％。 本发明还提供了一种赋予有机 - 无机复合材料的清漆，以及包括有机 - 无机复合材料的电子器件和半导体器件。