Abstract:
A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
Abstract:
Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.
Abstract:
Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.
Abstract:
A low resistance fuse includes a polymer membrane, a fuse element layer formed on the polymer membrane, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. At least one of the first and second intermediate insulation layers comprises an opening therethrough, and the polymer membrane supports the fuse element layer in the opening. A heat sink, heater elements, and arc quenching media may be used in combination with the fuse, and the fuse may be fabricated with an adhesive lamination process.
Abstract:
Methods of manufacturing low profile magnetic components configured as a power management devices for an electrical system of an electronic device involve prefabricated coil windings assembled with a plurality of flexible dielectric sheet layers, and laminating the plurality of flexible dielectric sheets around the prefabricated coil windings to form a dielectric body having a low profile chip configuration attachable to the electronic device.
Abstract:
A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
Abstract:
A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
Abstract:
A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.