High density trench DMOS transistor with trench bottom implant
    1.
    发明授权
    High density trench DMOS transistor with trench bottom implant 失效
    高密度沟槽DMOS晶体管,具有沟槽底部植入

    公开(公告)号:US5929481A

    公开(公告)日:1999-07-27

    申请号:US964419

    申请日:1997-11-04

    摘要: A trenched DMOS transistor overcomes the problem of a parasitic JFET at the trench bottom (caused by deep body regions extending deeper than the trench) by providing a doped trench bottom implant region at the bottom of the trench and extending into the surrounding drift region. This trench bottom implant region has the same doping type, but is more highly doped, than the surrounding drift region. The trench bottom implant region significantly reduces the parasitic JFET resistance by optimizing the trench bottom implant dose, without creating reliability problems.

    摘要翻译: 沟槽DMOS晶体管通过在沟槽的底部提供掺杂的沟槽底部注入区域并延伸到周围的漂移区域来克服沟槽底部的寄生JFET(由深沟槽深度延伸的深度)引起的问题。 该沟槽底部注入区域具有与周围漂移区域相同的掺杂类型,但是掺杂度更高。 通过优化沟槽底部注入剂量,沟槽底部注入区域显着降低寄生JFET电阻,而不会产生可靠性问题。