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1.发明授权Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权感光介电树脂组合物，由其形成的薄膜和包含这种薄膜的半导体和显示装置公开(公告)号：US07524594B2
公开(公告)日：2009-04-28
申请号：US11171391
申请日：2005-07-01
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
摘要翻译： 根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。 其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。
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2.发明授权Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权感光介电树脂组合物，由其形成的薄膜和包含这种薄膜的半导体和显示装置公开(公告)号：US07858721B2
公开(公告)日：2010-12-28
申请号：US12387025
申请日：2009-04-27
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
IPC分类号： C08F232/02 , G03F7/004
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
摘要翻译： 根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。 其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。
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公开(公告)号：US20090215976A1
公开(公告)日：2009-08-27
申请号：US12387025
申请日：2009-04-27
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Daoji Gan , Etsu Takeuchi , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Daoji Gan , Etsu Takeuchi , Seok Ho Kang
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
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公开(公告)号：US20060008734A1
公开(公告)日：2006-01-12
申请号：US11171391
申请日：2005-07-01
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Kang
IPC分类号： G03C1/492
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
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