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公开(公告)号:US12111321B2
公开(公告)日:2024-10-08
申请号:US18582448
申请日:2024-02-20
Applicant: SIRIGEN II LIMITED
Inventor: Brent S. Gaylord , Glenn P. Bartholomew , Russell A. Baldocchi , Janice W. Hong , William H. Huisman , Yongchao Liang , Trung Nguyen , Lan T. Tran , Jean M. Wheeler , Adrian Charles Vernon Palmer , Frank P. Uckert
IPC: G01N33/58 , C07K16/28 , C08G61/02 , C09B57/00 , C09B67/00 , C09B69/00 , C12Q1/6818 , C12Q1/682 , H10K85/10
CPC classification number: G01N33/58 , C07K16/2812 , C07K16/2815 , C08G61/02 , C09B57/00 , C09B68/41 , C09B69/00 , C12Q1/6818 , C12Q1/682 , G01N33/582 , H10K85/151 , C08G2261/1424 , C08G2261/3142 , C08G2261/411 , H10K85/115
Abstract: Described herein are methods, compositions and articles of manufacture involving neutral conjugated polymers including methods for synthesis of neutral conjugated water-soluble polymers with linkers along the polymer main chain structure and terminal end capping units. Such polymers may serve in the fabrication of novel optoelectronic devices and in the development of highly efficient biosensors. The invention further relates to the application of these polymers in assay methods.
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公开(公告)号:US20240309238A1
公开(公告)日:2024-09-19
申请号:US18419879
申请日:2024-01-23
Applicant: Samsung SDI Co., Ltd.
Inventor: Yunju Chae
IPC: C09D165/00 , C08G61/02 , C08G61/12 , G03F7/11 , H01L21/027 , H01L21/308 , H01L21/311 , H01L21/3213
CPC classification number: C09D165/00 , C08G61/02 , C08G61/124 , G03F7/11 , H01L21/0271 , H01L21/3081 , H01L21/31144 , H01L21/32139 , C08G2261/124 , C08G2261/1422 , C08G2261/18 , C08G2261/228 , C08G2261/314 , C08G2261/3241
Abstract: A hardmask composition, a hardmask layer including a cured product of the hardmask composition, and a method of forming patterns using the hardmask layer including a cured product of the hardmask composition, the hardmask composition includes a polymer including a structural unit represented by Chemical Formula 1; and a solvent:
*A-B* [Chemical Formula 1]-
3.
公开(公告)号:US12071508B2
公开(公告)日:2024-08-27
申请号:US17255239
申请日:2019-08-14
Applicant: LG Chem, Ltd.
Inventor: Hisayuki Kawamura
Abstract: Provided is a novel polymer capable of being used as a hole transfer material for an organic electronic device, particularly, an organic EL device.
The polymer of the present disclosure includes a repeating unit represented by Formula (1) as follows in 40 mol % to 100 mol % of the whole repeating unit forming the polymer,
wherein at least one of R4 and R5 is an aromatic amino group.-
公开(公告)号:US12065534B2
公开(公告)日:2024-08-20
申请号:US17541317
申请日:2021-12-03
Applicant: JSR CORPORATION
Inventor: Hiroyuki Komatsu , Motohiro Shiratani , Tatsuya Sakai
IPC: C08G61/02 , B05D3/02 , C09D165/00
CPC classification number: C08G61/02 , B05D3/0254 , C09D165/00
Abstract: A composition includes a polymer and a solvent. The polymer includes: a structural unit including a ring structure; and a functional group capable of bonding to a metal atom. An atom chain constituting the ring structure constitutes a part of a main chain of the polymer. The polymer preferably includes at an end of the main chain or at an end of a side chain, a group including the functional group. The functional group is preferably a cyano group, a phosphono group, or a dihydroxyboryl group. The ring structure preferably includes an alicyclic structure.
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公开(公告)号:US12032293B2
公开(公告)日:2024-07-09
申请号:US16841773
申请日:2020-04-07
Applicant: SHIN-ETSU CHEMICAL CO., LTD.
Inventor: Daisuke Kori , Takayoshi Nakahara , Yasuyuki Yamamoto , Hironori Satoh , Tsutomu Ogihara
CPC classification number: G03F7/11 , C08G61/02 , C08L83/04 , G03F7/34 , G03F7/70283 , C08G2261/135 , C08G2261/3142 , C08G2261/90 , H01L21/31144
Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A), and an organic solvent. The polymer is crosslinked by dehydrogenative coupling reaction involving hydrogen atoms located at the trityl position on the fluorene ring in each partial structure. Thus, the present invention provides: a composition for forming an organic film the composition containing such a thermosetting polymer with high carbon content as to enable high etching resistance and excellent twisting resistance; a patterning process using the composition; and a polymer suitable for the composition for forming an organic film
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公开(公告)号:US12024576B2
公开(公告)日:2024-07-02
申请号:US18164980
申请日:2023-02-06
Applicant: ORION POLYMER CORP.
Inventor: Chulsung Bae , Gregory Kline , Bharat Shrimant , Ding Tian , Xiaofeng Wang , Yu Seung Kim , Eun Joo Park , Santosh Adhikari
IPC: C08F232/06 , B01J41/14 , C08G10/00 , C08G61/02 , C08K5/17 , H01M8/1004
CPC classification number: C08F232/06 , B01J41/14 , C08K5/17 , C08G10/00 , C08G61/02 , C08G2261/1422 , C08G2261/143 , C08G2261/145 , C08G2261/146 , C08G2261/147 , C08G2261/148 , C08G2261/149 , C08G2261/31 , C08G2261/312 , C08G2261/314 , C08G2261/33 , C08G2261/45 , H01M8/1004
Abstract: Disclosed herein in various embodiments are aryl-ether free polyaromatic polymers based on random copolymer architecture with two, three, or more aromatic ring components and methods of preparing those polymers. The polymers of the present disclosure can be used as ion exchange membranes, e.g., as anion exchange membranes, and ionomer binders in alkaline electrochemical devices.
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公开(公告)号:US11940195B2
公开(公告)日:2024-03-26
申请号:US17751500
申请日:2022-05-23
Applicant: FFI IONIX IP, INC.
Inventor: Bamdad Bahar
IPC: F25B9/00 , B01D67/00 , B01D69/02 , B01D69/10 , B01D69/12 , B01D71/28 , B01D71/44 , B05D3/02 , B05D3/06 , C08G61/02 , C08J3/24 , C08J5/22 , C25B9/23 , F25B31/00
CPC classification number: F25B9/008 , B01D67/0006 , B01D67/0093 , B01D69/02 , B01D69/10 , B01D69/125 , B01D71/28 , B01D71/44 , B05D3/0254 , B05D3/067 , C08G61/02 , C08J3/24 , C08J5/2231 , C08J5/2256 , C25B9/23 , F25B9/002 , F25B31/00 , B01D2323/08 , B01D2323/30 , B01D2323/345 , B01D2323/36 , B01D2325/16 , B01D2325/42 , C08G2261/143 , C08G2261/146 , C08G2261/312 , C08G2261/3326 , C08G2261/516 , C08G2261/72 , C08J2325/16 , C08J2365/02 , Y02E60/36
Abstract: An electrochemical compressor utilizes an anion conducting layer disposed between an anode and a cathode for transporting a working fluid. The working fluid may include carbon dioxide that is dissolved in water and is partially converted to carbonic acid that is equilibrium with bicarbonate anion. An electrical potential across the anode and cathode creates a pH gradient that drives the bicarbonate anion across the anion conducting layer to the cathode, wherein it is reformed into carbon dioxide. Therefore, carbon dioxide is pumped across the anion conducting layer. The compressor may be part of a refrigeration system that pumps the working fluid in a closed loop through a condenser and an evaporator.
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公开(公告)号:US11932724B1
公开(公告)日:2024-03-19
申请号:US17220282
申请日:2021-04-01
Inventor: Benjamin G. Harvey , Kyle E. Rosenkoetter
CPC classification number: C08G61/02 , C07C1/20 , C08F36/02 , C08F2500/07 , C08G2261/13 , C08G2261/3325 , C08G2261/592 , C08G2261/76
Abstract: A novel family of cycloalkanes compounds having one or more allylidene functionalities which can be used to create cross-linked thermosets and thermoplastics having thermal stability. An example heptacyclo [6.6.0.02,6.03,13.04,11.05,9.010,14] tetradecane (HCTD) complex with terminal allylidene groups at the 7- and 12-positions (HCTD-7,12-diallylidene) was generated from norbornadiene via an efficient six-step synthesis. Thermal polymerization at temperatures ranging from 160 to 240° C. yielded a robust cross-linked material with thermal stability up to 485° C. in air, a glass transition temperature of 377° C., and a char yield (600° C.) of 56% in air. Applications include heat resistant composites utilized in the aerospace, electronic, automotive and textile industries.
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公开(公告)号:US11884773B2
公开(公告)日:2024-01-30
申请号:US17415141
申请日:2019-12-09
Inventor: Masahiro Soh , Kazuo Ishihara , Jin Soo Lee , Jae Il Kim , Joong Hwi Jee , Ki Hwan Yu
IPC: C08G61/02 , C08G59/02 , C08G59/62 , C08J5/24 , C08G59/06 , C08G59/32 , C08L65/00 , C08G59/08 , B32B27/20 , B32B27/38 , H05K1/03
Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.
In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.-
公开(公告)号:US20230420684A1
公开(公告)日:2023-12-28
申请号:US18347757
申请日:2023-07-06
Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Inventor: Gao Liu , Tianyu Zhu
IPC: H01M4/62 , H01M4/13 , H01M4/66 , H01M4/38 , H01M4/134 , C08F220/18 , C08F220/06 , C08G73/02 , C08G61/12 , C08G61/02
CPC classification number: H01M4/622 , H01M4/13 , H01M4/661 , H01M4/382 , H01M4/134 , C08F220/1818 , C08F220/1806 , C08F220/06 , C08G73/0266 , C08G61/126 , C08G61/02 , H01M2004/021
Abstract: A conductive polymer that can be formed by removing or separating a side chain, or alkyl or aryl side chain from an unmodified polymer by heating or exposure to light (hv).
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