Hand-held pick-up device
    1.
    发明授权
    Hand-held pick-up device 失效
    手持式拾音装置

    公开(公告)号:US5106139A

    公开(公告)日:1992-04-21

    申请号:US553855

    申请日:1990-07-16

    IPC分类号: B25B11/00

    摘要: Light-weight items or components may be picked-up and moved from space restricted areas. The method of lifting and placing such items involves the use of a hand-held tool, comprising a hollow tube containing a suction creating device, which suction creating device may be engaged by pressing an actuator member located in a hole in the hollow tube. A tip is attached to an open end of the hollow tube, so that air is expelled from and drawn into the suction creating device in the hollow tube through the tip. A gripping member is removably attached to the tip. The gripping member comprises a suction cup, an extension tube, and a fitting by which the gripping member is attached to the tip. A variety of gripping members, with suction cups of varying sizes and extension tubes of differing angles, may be used with the pick-up device. After expelling air from the suction creating device by use of the actuator member, the pick-up tool is lowered onto the item to be picked up, so that the suction cup comes into contact with that item. The actuator member is then disengaged to allow air to be drawn into the suction creating device, causing the item to be held against the suction cup. In this way, the item may be moved to another location, and released by depressing the actuator member.

    摘要翻译: 重量轻的物品或部件可以从空间受限的区域被拾起并移动。 提起和放置这种物品的方法涉及使用手持工具,其包括含有吸引产生装置的中空管,该吸引产生装置可以通过按压位于中空管中的孔中的致动器构件而接合。 尖端附接到中空管的开口端,使得空气通过尖端被排出并吸入中空管中的吸引产生装置。 夹持构件可移除地附接到尖端。 夹持构件包括吸盘,延伸管和配件,夹持构件通过该配件附接到尖端。 具有不同尺寸的吸盘和不同角度的多个夹持构件可以与拾取装置一起使用。 在通过使用致动器构件从吸引产生装置排出空气之后,拾取工具下降到待拾取的物品上,使得吸盘与该物品接触。 然后致动器构件被分离以允许空气被吸入吸入产生装置,使物品被保持抵靠吸盘。 以这种方式,物品可以移动到另一位置,并且通过按下致动器构件而被释放。

    Battery operated hand held vacuum handling device
    2.
    发明授权
    Battery operated hand held vacuum handling device 失效
    电池操作的手持式真空处理装置

    公开(公告)号:US5290082A

    公开(公告)日:1994-03-01

    申请号:US908373

    申请日:1992-07-06

    IPC分类号: B25B11/00 B25J15/06

    CPC分类号: B25B11/007 Y10T29/53191

    摘要: A hand held tool for grasping and moving light weight objects includes a battery powered vacuum. Upon pressing an actuator, an electrical circuit is completed, activating the vacuum pump. The vacuum pump draws air from a valving system, causing air to be drawn through a nozzle. A variety of gripping devices may be attached to the nozzle, so that air is also drawn through the attached gripping device when the vacuum pump is activated. As a result, the gripping device may be placed in proximity to a light weight object, so that activation of the vacuum pump results in that object being held against the gripping device, for ease of movement, until the vacuum pump is deactivated.

    摘要翻译: 用于抓握和移动重量轻的物体的手持工具包括电池供电的真空。 按下执行器后,完成电路,激活真空泵。 真空泵从阀门系统吸取空气,使空气通过喷嘴被吸入。 各种夹持装置可以附接到喷嘴,使得当真空泵被激活时,空气也被抽吸通过附接的夹持装置。 结果,夹持装置可以放置在靠近轻质物体的位置,使得真空泵的启动导致该物体被保持抵靠夹持装置,以便于移动,直到真空泵被停用。

    Surface mounted device rework heat guide
    3.
    发明授权
    Surface mounted device rework heat guide 失效
    表面贴装返修导热板

    公开(公告)号:US4813589A

    公开(公告)日:1989-03-21

    申请号:US178030

    申请日:1988-04-05

    CPC分类号: H05K13/0491 B23K1/012

    摘要: Leaded and leadless surface mounted devices are removed from or attached to a printed circuit board at various locations, without interfering with or adversely affecting other chips on the printed circuit board. The method of removal involves placing a tool on the substrate, comprising a rigid plate containing a hole, and a hollow tube extending beneath the hole from the rigid plate to the substrate. In this way a surface mounted device to be removed may be surrounded completely by the hollow tube, without encompassing adjacent chips. When heat is directed through the hole in the rigid plate and through the hollow tube to the surface mounted device, the soldered connections attaching the surface mounted device to the board may be melted. A disconnecting means is utilized to remove the surface mounted device from the substrate at the moment the soldered connections are melted or, in the case of non-eutectic solder, changed to a plastic phase. The same tool may be used to facilitate the attachment of a surface mounted device to a printed circuit board, by applying hot gas to the component to be attached, through the hollow tube surrounding that component, as solder is applied to form a plurality of soldered connections.

    摘要翻译: 带引线和无引线表面安装器件在各种位置从印刷电路板上移除或附着到印刷电路板上,而不会干扰或不利地影响印刷电路板上的其它芯片。 去除方法包括将工具放置在基板上,包括含有孔的刚性板和在孔下方从刚性板延伸到基板的中空管。 以这种方式,待移除的表面安装装置可以被中空管完全包围,而不包括相邻的芯片。 当热被引导通过刚性板中的孔并且通过中空管到达表面安装装置时,将表面安装的装置连接到基板上的焊接连接可能被熔化。 在焊接连接熔化的时刻,或者在非共晶焊料的情况下,改变为塑性相,利用断开装置将表面安装的装置从衬底上移除。 可以使用相同的工具来通过将围绕该部件的中空管施加热气体到待连接的部件上,以便将表面安装的装置附着到印刷电路板上,因为焊料被施加以形成多个焊接 连接。