公开(公告)号：US06232148B1

公开(公告)日：2001-05-15

申请号：US09290733

申请日：1999-04-13

申请人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Darryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

发明人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Darryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

IPC分类号： H01L2344

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.

摘要翻译： 一种用于增加集成电路密度的装置和方法，包括至少一对叠加的骰子，其中所述叠加的骰子中的至少一个具有可变地定位在所述骰子的有效表面上的至少一个接合衬垫。 来自引线框架的多根引线指在芯片之间延伸。 引线框架包括至少一个引线，引线具有不均匀的长度和结构，以连接到多个裸片的不同定位的焊盘。 本发明的一个优点是，允许具有不同粘合垫布置的骰子以叠加配置使用以增加电路密度，同时消除在这种配置中使用接合线。