公开(公告)号：US4978422A

公开(公告)日：1990-12-18

申请号：US496337

申请日：1990-03-20

Applicant: Raymond A. Letize ,  David D. Sullivan ,  William R. Thomas ,  Thomas D. Murry

Inventor： Raymond A. Letize ,  David D. Sullivan ,  William R. Thomas ,  Thomas D. Murry

IPC: C23F1/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/26

CPC classification number: H05K3/26 ,  H05K2201/0761 ,  H05K2203/043 ,  H05K2203/0723 ,  H05K2203/0796 ,  H05K3/06 ,  H05K3/108

Abstract: After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

Abstract translation: 在基于铜箔包覆的绝缘衬底材料的印刷电路工艺中，在蚀刻掉铜以选择性地暴露绝缘材料的表面积之后，将绝缘材料的暴露表面积与碱性高锰酸盐溶液接触以从残留的区域中除去 与其相关联的金属物质，以便改善由印刷电路中的这些区域提供的电阻。