公开(公告)号：USRE36894E

公开(公告)日：2000-10-03

申请号：US229857

申请日：1994-04-19

申请人： Lawrence Arnold Greenberg ,  David Jacob Lando

发明人： Lawrence Arnold Greenberg ,  David Jacob Lando

IPC分类号： H01L23/495 ,  H01L23/498 ,  H05K7/20

CPC分类号： H01L23/49558 ,  H01L23/49541 ,  H01L23/49861 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49

摘要： Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the ringers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

摘要翻译： 公开了一种半导体封装，其允许将半导体接合焊盘耦合到需要高密度连接的I / O引线。 由绝缘带支撑的导电指状物在引线框架上结合到振铃器的端部。 带状指状物通过引线接合电耦合到半导体芯片的一个主表面上的接合焊盘。 在一个实施例中，芯片的相对的主表面通过带中的孔结合到引线框架上的桨，用于最大的散热。