摘要:
A hot melt adhesive dispensing unit includes an adhesive supply for receiving solid or semi-solid hot melt adhesive material, an adhesive supply heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive material into a liquid hot melt adhesive material, a manifold connected to the adhesive supply and including a flow rate sensor for measuring a flow rate of the liquid hot melt adhesive material, the flow rate sensor generating flow rate information, a pump connected to the manifold for pumping liquid hot melt adhesive material from the adhesive supply into the manifold, the pump including a pump motor, and a variable frequency drive for controlling the pump motor. The variable frequency drive is in communication with the flow rate sensor for receiving the flow rate information and the pump motor for controlling the speed of the pump motor.
摘要:
A hot melt adhesive dispensing unit includes an adhesive supply for receiving solid or semi-solid hot melt adhesive material, an adhesive supply heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive material into a liquid hot melt adhesive material, a manifold connected to the adhesive supply and including a flow rate sensor for measuring a flow rate of the liquid hot melt adhesive material, the flow rate sensor generating flow rate information, a pump connected to the manifold for pumping liquid hot melt adhesive material from the adhesive supply into the manifold, the pump including a pump motor, and a variable frequency drive for controlling the pump motor. The variable frequency drive is in communication with the flow rate sensor for receiving the flow rate information and the pump motor for controlling the speed of the pump motor.