公开(公告)号：US20060076230A1

公开(公告)日：2006-04-13

申请号：US10711818

申请日：2004-10-07

申请人： William Murphy ,  David Strippe

发明人： William Murphy ,  David Strippe

IPC分类号： C23C14/00

CPC分类号： H01J37/3435 ,  C23C14/35

摘要： A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target.

摘要翻译： 一种用于溅射沉积的方法和装置。 该方法包括：提供具有后表面和暴露的前表面的溅射靶; 提供磁场线源，所述磁场线从所述溅射靶的背表面延伸穿过所述溅射靶到所述暴露的前表面; 在磁场线的源极和溅射靶的暴露的前表面的磁极之间提供一个或多个极点延伸器。