公开(公告)号：US20130320530A1

公开(公告)日：2013-12-05

申请号：US13483064

申请日：2012-05-30

申请人： Dominic Poh Meng Koey ,  Zhiwei Gong

发明人： Dominic Poh Meng Koey ,  Zhiwei Gong

IPC分类号： H01L21/56 ,  H01L23/485

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A surface mount semiconductor device is assembled by positioning an array of semiconductor dies with an array of metallic ground plane members between and beside the semiconductor dies. The arrays of dies and ground plane members are encapsulated in a molding compound. A redistribution layer is formed on the arrays of dies and ground plane members. The redistribution layer has an array of sets of redistribution conductors within a layer of insulating material. The redistribution conductors interconnect electrical contacts of the dies with external electrical contact elements of the device. As multiple devices are formed at the same time, adjacent devices are separated (singulated) by cutting along saw streets between the dies. The molding compound is interposed between tie bars of the ground plane members and the insulating material of the redistribution layer in the saw streets, and at the side surfaces of the singulated devices.

摘要翻译： 通过在半导体管芯之间和之外定位具有金属接地平面构件阵列的半导体管芯阵列来组装表面贴装半导体器件。 模具阵列和接地平面构件被封装在模塑料中。 在模具和接地平面构件阵列上形成再分布层。 再分配层在绝缘材料层内具有一组再分布导体。 再分布导体将模具的电触点与器件的外部电接触元件互连。 随着多个装置同时形成，相邻的装置通过沿模具之间的锯条切割而分离（分割）。 模制化合物插入在接地平面构件的连接杆之间以及在锯道中的再分配层的绝缘材料以及分割装置的侧表面处。

公开(公告)号：US09000589B2

公开(公告)日：2015-04-07

申请号：US13483064

申请日：2012-05-30

申请人： Dominic Poh Meng Koey ,  Zhiwei Gong

发明人： Dominic Poh Meng Koey ,  Zhiwei Gong

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A surface mount semiconductor device is assembled by positioning an array of semiconductor dies with an array of metallic ground plane members between and beside the semiconductor dies. The arrays of dies and ground plane members are encapsulated in a molding compound. A redistribution layer is formed on the arrays of dies and ground plane members. The redistribution layer has an array of sets of redistribution conductors within a layer of insulating material. The redistribution conductors interconnect electrical contacts of the dies with external electrical contact elements of the device. As multiple devices are formed at the same time, adjacent devices are separated (singulated) by cutting along saw streets between the dies. The molding compound is interposed between tie bars of the ground plane members and the insulating material of the redistribution layer in the saw streets, and at the side surfaces of the singulated devices.

摘要翻译： 通过在半导体管芯之间和之外定位具有金属接地平面构件阵列的半导体管芯阵列来组装表面贴装半导体器件。 模具阵列和接地平面构件被封装在模塑料中。 在模具和接地平面构件阵列上形成再分布层。 再分配层在绝缘材料层内具有一组再分布导体。 再分布导体将模具的电触点与器件的外部电接触元件互连。 随着多个装置同时形成，相邻的装置通过沿模具之间的锯条切割而分离（分割）。 模制化合物插入在接地平面构件的连接杆之间以及在锯道中的再分配层的绝缘材料以及分割装置的侧表面处。