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公开(公告)号：US20060074586A1
公开(公告)日：2006-04-06
申请号：US11241846
申请日：2005-09-30
申请人： Thomas Kautz , Dominic Ticali , Robert Freimuth
发明人： Thomas Kautz , Dominic Ticali , Robert Freimuth
IPC分类号： H05B1/02
CPC分类号： H05K1/147 , G01K7/427 , G01K17/20 , H05K1/189 , H05K3/366 , H05K2201/048 , H05K2201/10151 , H05K2201/10598
摘要： The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.
摘要翻译： 本发明涉及一种具有第一温度传感器的温度感测装置，该第一温度传感器在邻近壳体的第一表面的第一位置处安装到壳体。 第一温度传感器感测第一温度，而第二温度传感器感测第二温度。 处理器电路耦合到第一和第二温度传感器，并且安装装置耦合到壳体或处理器电路。 安装装置将第二温度传感器安装在靠近壳体的与第一表面间隔开的第二表面的第二位置处。 处理器电路被配置为基于第一和第二温度估计第三温度，以及第一和第二位置之间的距离，其是在第三位置处的温度的估计。
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公开(公告)号：US07395173B2
公开(公告)日：2008-07-01
申请号：US11241846
申请日：2005-09-30
CPC分类号： H05K1/147 , G01K7/427 , G01K17/20 , H05K1/189 , H05K3/366 , H05K2201/048 , H05K2201/10151 , H05K2201/10598
摘要： The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.
摘要翻译： 本发明涉及一种具有第一温度传感器的温度感测装置，该第一温度传感器在邻近壳体的第一表面的第一位置处安装到壳体。 第一温度传感器感测第一温度，而第二温度传感器感测第二温度。 处理器电路耦合到第一和第二温度传感器，并且安装装置耦合到壳体或处理器电路。 安装装置将第二温度传感器安装在靠近壳体的与第一表面间隔开的第二表面的第二位置处。 处理器电路被配置为基于第一和第二温度估计第三温度，以及第一和第二位置之间的距离，其是在第三位置处的温度的估计。
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