Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
    1.
    发明授权
    Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor 有权
    多层片式电容器和具有嵌入式多层片式电容器的印刷电路板

    公开(公告)号:US07230815B2

    公开(公告)日:2007-06-12

    申请号:US11288802

    申请日:2005-11-29

    IPC分类号: H01G4/005 H01G4/06

    CPC分类号: H01G4/232 H01G4/30 H05K1/185

    摘要: A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the equivalent series resistant (ESR) and equivalent series inductance (ESL). Further, the printed circuit board (PCB) having an embedded MLCC is easily manufactured.

    摘要翻译: 多层片状电容器(MLCC)包括形成为垂直于内部电极的内部电极和外部电极,由此寄生电容减小,导致没有并联谐振频率效应。 此外,MLCC具有电容器结构,其提供在电容器主体中的电介质层的堆叠方向上形成的第一表面和第二表面作为顶表面和底表面。 因此,在具有相同尺寸的薄电容器中,内部电极层的数量增加,从而降低等效串联电阻(ESR)和等效串联电感(ESL)。 此外,具有嵌入式MLCC的印刷电路板(PCB)容易制造。