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    Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
    1.
    发明授权
    Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor 有权
    多层片式电容器和具有嵌入式多层片式电容器的印刷电路板

    公开(公告)号：US07230815B2

    公开(公告)日：2007-06-12

    申请号：US11288802

    申请日：2005-11-29

    申请人： Hee Soo Yoon ,  Chang Hoon Shim ,  Don Cheol Choi ,  Dong Hwan Lee

    发明人： Hee Soo Yoon ,  Chang Hoon Shim ,  Don Cheol Choi ,  Dong Hwan Lee

    IPC分类号： H01G4/005 ,  H01G4/06

    CPC分类号： H01G4/232 ,  H01G4/30 ,  H05K1/185

    摘要： A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the equivalent series resistant (ESR) and equivalent series inductance (ESL). Further, the printed circuit board (PCB) having an embedded MLCC is easily manufactured.

    摘要翻译： 多层片状电容器（MLCC）包括形成为垂直于内部电极的内部电极和外部电极，由此寄生电容减小，导致没有并联谐振频率效应。 此外，MLCC具有电容器结构，其提供在电容器主体中的电介质层的堆叠方向上形成的第一表面和第二表面作为顶表面和底表面。 因此，在具有相同尺寸的薄电容器中，内部电极层的数量增加，从而降低等效串联电阻（ESR）和等效串联电感（ESL）。 此外，具有嵌入式MLCC的印刷电路板（PCB）容易制造。

    PRINTED CIRCUIT BOARD FOR REDUCING CROSSTALK
    2.
    发明申请
    PRINTED CIRCUIT BOARD FOR REDUCING CROSSTALK 审中-公开
    印刷电路板，用于减少CROSSTALK

    公开(公告)号：US20120081869A1

    公开(公告)日：2012-04-05

    申请号：US13251780

    申请日：2011-10-03

    申请人： Yoon Dong KIM ,  Hee Soo Yoon ,  Jong Lae Kim ,  Su Bong Jang ,  Dong Hwan Lee ,  Kyoung Ho Lee

    发明人： Yoon Dong KIM ,  Hee Soo Yoon ,  Jong Lae Kim ,  Su Bong Jang ,  Dong Hwan Lee ,  Kyoung Ho Lee

    IPC分类号： H05K1/16 ,  H05K9/00

    CPC分类号： H04B15/02 ,  H04B1/40

    摘要： There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced.

    摘要翻译： 提供了一种用于减少串扰的印刷电路板，具有连接在信号和接地图案之间的电容性阻抗分量，印刷电路板包括：包括传输低频信号的第一信号图案和传送高频信号的第二信号图案的信号图案; 包括连接到第一信号图案的第一接地图案​​和连接到第二信号图案的彼此分离的第二接地图案的接地图案; 以及连接在第一和第二接地图案之间并且屏蔽从印刷电路板产生的电磁波的导电屏蔽膜。 因此，可以减小低频和高频信号之间的串扰。

    INTERFACE OF MULTI CHIP MODULE
    3.
    发明申请
    INTERFACE OF MULTI CHIP MODULE 审中-公开
    多芯片模块接口

    公开(公告)号：US20120289173A1

    公开(公告)日：2012-11-15

    申请号：US13444538

    申请日：2012-04-11

    申请人： Kyoung Ho Lee ,  Su Bong Jang ,  Dong Hwan Lee ,  Hee Soo Yoon

    发明人： Kyoung Ho Lee ,  Su Bong Jang ,  Dong Hwan Lee ,  Hee Soo Yoon

    IPC分类号： H04B1/44 ,  H04B1/40 ,  H04B1/04

    CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.

    摘要翻译： 这里公开了多芯片模块在多个芯片之间发送和接收数据的接口。 多芯片模块的接口包括设置在芯片中并发送和接收数据的通信单元; 以及设置在芯片外部的无线电通信单元，将从通信单元发送的数据转换为无线电信号并无线发送无线电信号，并将从其他芯片接收的无线电信号解调为数据，并将数据发送到通信单元，由此 有线通信芯片可以实现无线电通信。

    Balun
    5.
    发明授权
    Balun 有权
    巴伦

    公开(公告)号：US07956702B2

    公开(公告)日：2011-06-07

    申请号：US12262206

    申请日：2008-10-31

    申请人： Dong Hwan Lee ,  Hee Soo Yoon

    发明人： Dong Hwan Lee ,  Hee Soo Yoon

    IPC分类号： H03H7/42 ,  H01P5/12

    CPC分类号： H01P5/10 ,  H03H7/1758 ,  H03H7/1775 ,  H03H7/422

    摘要： A balun having a first balanced terminal, a second balanced terminal and an unbalanced terminal, includes a filter unit and a first transmission line. The filter unit is connected to the first balanced terminal, the second balanced terminal and the unbalanced terminal, and includes a low-pass filter and a high-pass filter. The first transmission line is connected between the filter unit and the first balanced terminal.

    摘要翻译： 具有第一平衡端子，第二平衡端子和不平衡端子的平衡 - 不平衡转换器包括滤波器单元和第一传输线。 滤波器单元连接到第一平衡端子，第二平衡端子和不平衡端子，并且包括低通滤波器和高通滤波器。 第一传输线连接在滤波器单元和第一平衡端子之间。

    Laminated filter with improved stop band attenuation
    6.
    发明授权
    Laminated filter with improved stop band attenuation 失效
    具有改善阻带衰减的层压滤波器

    公开(公告)号：US07262675B2

    公开(公告)日：2007-08-28

    申请号：US11126361

    申请日：2005-05-11

    申请人： Dong Hwan Lee ,  Sung Yeol Park ,  Ki Pyo Hong ,  Hee Soo Yoon

    发明人： Dong Hwan Lee ,  Sung Yeol Park ,  Ki Pyo Hong ,  Hee Soo Yoon

    IPC分类号： H01P3/08

    CPC分类号： H01P1/20345

    摘要： Disclosed herein is a laminated filter with improved stop band attenuation, which is adopted in devices using a radio frequency, such as communication systems and/or broadcasting systems. The laminated filter forms cross capacitive coupling as feeding lines of input lead and/or output lead are coupled to a resonator pattern, and enhances an attenuation characteristic of stop band. Also, the laminated filter is minimized if feeding lines of the input lead and output lead are aligned in different layers, and the positions of the attenuation poles are easily controlled by adjusting the feeding line length.

    摘要翻译： 本文公开了一种具有改进的阻带衰减的层叠滤波器，其被用于使用诸如通信系统和/或广播系统之类的射频的设备中。 当输入引线和/或输出引线的馈线被耦合到谐振器图案时，层叠滤波器形成交叉电容耦合，并且增强阻带的衰减特性。 此外，如果输入引线和输出引线的馈线在不同层中对准，则层压滤波器最小化，并且通过调节馈线长度容易地控制衰减极的位置。

    Multilayer LC composite component
    8.
    发明授权
    Multilayer LC composite component 有权
    多层LC复合材料

    公开(公告)号：US07928819B2

    公开(公告)日：2011-04-19

    申请号：US12211331

    申请日：2008-09-16

    申请人： Dong Hwan Lee ,  Hee Soo Yoon

    发明人： Dong Hwan Lee ,  Hee Soo Yoon

    IPC分类号： H03H7/01 ,  H01P1/203

    CPC分类号： H03H7/0115 ,  H03H7/1766 ,  H03H7/1775 ,  H03H2001/0085

    摘要： There is provided a band pass filter including: a stacked body having a stacked structure of a plurality of dielectric sheets; and a plurality of elements provided in the stacked body, the plurality of elements including: a first capacitor electrode; a second capacitor electrode partially overlapping the first capacitor electrode to form capacitive coupling; a third capacitor electrode connected to the second capacitor electrode; a first inductor pattern having one end connected to the first capacitor electrode and the other end connected to a ground; a second inductor pattern having one end connected to the third capacitor electrode and the other end connected to the ground; an input terminal provided at one region of the first inductor pattern; and an output terminal provided at one region of the second inductor pattern.

    摘要翻译： 提供了一种带通滤波器，包括：堆叠体，其具有多个电介质层的堆叠结构; 以及设置在所述层叠体中的多个元件，所述多个元件包括：第一电容器电极; 第二电容器电极部分地与第一电容器电极重叠以形成电容耦合; 连接到第二电容器电极的第三电容器电极; 第一电感器图案，其一端连接到第一电容器电极，另一端连接到地; 第二电感器图案，其一端连接到第三电容器电极，另一端连接到地; 输入端子，设置在所述第一电感器图案的一个区域; 以及设置在第二电感器图案的一个区域处的输出端子。

    RADIO FREQUENCY COMMUNICATION MODULE
    9.
    发明申请
    RADIO FREQUENCY COMMUNICATION MODULE 审中-公开
    无线电频率通信模块

    公开(公告)号：US20120250267A1

    公开(公告)日：2012-10-04

    申请号：US13330625

    申请日：2011-12-19

    申请人： Dong Hwan Lee ,  Hee Soo Yoon ,  Su Bong Jang

    发明人： Dong Hwan Lee ,  Hee Soo Yoon ,  Su Bong Jang

    IPC分类号： H05K7/00

    CPC分类号： H05K9/0022 ,  H05K9/0045

    摘要： Disclosed herein is a radio frequency (RF) communication module. The RF communication module includes: a main substrate having a plurality of electronic components mounted on an upper surface thereof and having at least one ground pad formed at corners thereof; an insulating material encapsulating the electronic components mounted on the upper surface of the main substrate and having a metal layer formed on an upper surface thereof; and a side shielding layer formed on a side of the insulating material.

    摘要翻译： 本文公开了射频（RF）通信模块。 RF通信模块包括：主基板，其具有安装在其上表面上的多个电子部件，并且在其角部具有至少一个接地焊盘; 绝缘材料，其封装安装在所述主基板的上表面上并具有形成在其上表面上的金属层的电子部件; 以及形成在绝缘材料的侧面上的侧面屏蔽层。