公开(公告)号：US5126028A

公开(公告)日：1992-06-30

申请号：US570943

申请日：1990-08-22

申请人： Steven D. Hurwitt ,  Israel Wagner ,  Robert Hieronymi ,  Charles Van Nutt ,  Richard C. Edwards ,  Donald A. Messina

发明人： Steven D. Hurwitt ,  Israel Wagner ,  Robert Hieronymi ,  Charles Van Nutt ,  Richard C. Edwards ,  Donald A. Messina

IPC分类号： C23C14/04 ,  C23C14/34 ,  C23C14/54 ,  H01J37/34

CPC分类号： H01J37/32935 ,  C23C14/04 ,  C23C14/046 ,  C23C14/3407 ,  C23C14/54 ,  H01J37/3408 ,  H01J37/3423 ,  H01J37/3452 ,  H01J37/3458 ,  H01J2237/3327

摘要： A sputter coating apparatus displays set and alternative machine parameters, entered or calculated from entered or measured data, for selection by the operator. The apparatus performs a sputter coating process to produce sputter coated articles in accordance with the selected machine parameters. Process parameters familiar to the person creating the process, such as desired coating thickness and desired deposition rate, may be entered by the operator. Measured data such as actual coating thickness at a plurality of points on a previously processed wafer may be entered by an operator or automatically measured from a wafer. Alternative machine parameters such as target sputtering power may be entered by an operator or calculated from entered process parameters or measured data. The operator selects and initiates a process in accordance with the selections by entering commands. The machine parameters control separately the sputtering from different regions of the sputtering surface of a one piece sputtering target by alternately energizing different plasmas over the different target regions and energizing the target in accordance with different machine parameters.

摘要翻译： 溅射涂层设备显示由输入或测量数据输入或计算的设置和替代机器参数，以供操作员选择。 该设备执行溅射涂覆工艺以根据所选择的机器参数产生溅射涂覆的物品。 可以由操作者输入创建该过程的人熟悉的工艺参数，例如所需的涂层厚度和所需的沉积速率。 在先前处理的晶片上的多个点处的实际涂层厚度的测量数据可以由操作者输入或者从晶片自动测量。 可以由操作者输入替代的机器参数，例如目标溅射功率，或从输入的过程参数或测量数据计算。 操作人员通过输入命令，根据选择选择并启动进程。 机器参数通过在不同的目标区域上交替地激励不同的等离子体，并根据不同的机器参数对目标进行激励，分别地控制一片溅射靶的溅射表面的不同区域的溅射。