公开(公告)号：US06643903B2

公开(公告)日：2003-11-11

申请号：US09812371

申请日：2001-03-16

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

IPC: H01G700

CPC classification number: H01G4/35 ,  A61N1/3754 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147

Abstract: A process for manufacturing an EMI filter feedthrough terminal assembly is provided for mating a feedthrough filter capacitor with an hermetic terminal assembly including a ferrule and one or more lead wires which extend through the ferrule in non-conductive relation. The process includes the steps of placing the hermetic terminal assembly, having a capture flange, into a holding fixture, and forming a seat of non-conductive thermal-setting material onto the terminal assembly within the capture flange. A feedthrough filter capacitor is loaded into the capture flange on top of the seat, and then the seat is cured. A conductive thermal-setting material is dispensed between an outer diameter of the feedthrough filter capacitor and the capture flange. The assembly is then centrifuged to pack the conductive thermal-setting material. The conductive thermal-setting material is then cured between the outer diameter of the feedthrough filter capacitor and the capture flange. Preferably, the height of the capture flange is one-quarter to three-quarters of an axial thickness of the capacitor.

Abstract translation: 提供了一种用于制造EMI滤波器馈通端子组件的方法，用于将馈通滤波电容器与包括套圈和一个或多个引线的密封端子组件配合，该导线以非导电关系延伸穿过套圈。 该方法包括以下步骤：将具有捕获凸缘的密封端子组件放置到保持夹具中，以及在捕获凸缘内的终端组件上形成非导电热固化材料座。 馈通滤波电容器装载到座椅顶部的捕获法兰中，然后固定座椅。 导通热固化材料分配在馈通滤波电容器的外径与捕获凸缘之间。 然后将组件离心以包装导电热定型材料。 导电热固化材料然后在馈通滤波电容器的外径和捕获凸缘之间固化。 优选地，捕获凸缘的高度是电容器的轴向厚度的四分之三到四分之三。

公开(公告)号：US06567259B2

公开(公告)日：2003-05-20

申请号：US10251672

申请日：2002-09-20

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  John E. Roberts

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  John E. Roberts

IPC: H01G435

CPC classification number: A61N1/3754 ,  H01G4/35

Abstract: A feedthrough filter capacitor assembly for use in active implantable medical devices and a related process for manufacturing a monolithic ceramic capacitor utilizing dielectric materials having a dielectric constant greater than 7000, and preferably in the range of 8500 to 22,000. In the manufacture of the monolithic ceramic capacitor, one or more Curie point shifters and/or other dopants are added to the dielectric material to optimize the dielectric constant at the human body temperature of 37° C. For manufacturing purposes, dopants may be added to the dielectric material to broaden the Curie point peak or point of maximum dielectric constant thereof. The effect is that when such capacitors and terminal assemblies are utilized in a high-voltage defibrillator circuit of an implantable medical device, the dielectric material is optimized so that during the delivery of high-voltage electrical energy, capacitance value of the capacitor drops substantially.

Abstract translation: 用于有源可植入医疗装置的馈通滤波电容器组件和利用介电常数大于7000，优选在8500至22,000范围内的介电材料制造单片陶瓷电容器的相关方法。 在制造叠层陶瓷电容器时，将一个或多个居里点移位器和/或其它掺杂剂添加到电介质材料中以使人体温度为37℃下的介电常数最优化。为了制造目的，可以将掺杂剂添加到 电介质材料以扩大居里点峰值或其最大介电常数点。 其效果在于，当将这种电容器和端子组件用于可植入医疗装置的高压除颤器电路时，电介质材料被优化，使得在高压电能传递期间，电容器的电容值基本上下降。

公开(公告)号：US06275369B1

公开(公告)日：2001-08-14

申请号：US09460879

申请日：1999-12-14

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

IPC: H01G435

CPC classification number: H03H1/0007 ,  A61N1/3754 ,  H01G4/35

Abstract: An EMI filter feedthrough terminal assembly includes at least one conductive terminal pin, a feedthrough filter capacitor which has a passageway through which the terminal pin extends, and a conductive substrate through which the terminal pin passes in non-conductive relation. The conductive substrate includes a capture flange having a height that is less than an axial thickness of the capacitor and which is configured to at least partially surround an outer periphery of the capacitor. The height of the capture flange is preferably one-quarter to three-quarters of the axial thickness of the capacitor. A first set of capacitor electrodeplates is conductively coupled to the terminal pin, and a second set of electrode plates is conductively coupled to the capture flange by means of a thermal-setting conductive material disposed between the outer periphery of the capacitor and the capture flange. A related process is provided for manufacturing an EMI filter feedthrough terminal assembly that advantageously utilizes the capture flange.

Abstract translation: EMI滤波器馈通端子组件包括至少一个导电端子引脚，馈通滤波电容器，其具有端子引脚延伸穿过的通道以及端子引脚通过非导电关系的导电基板。 导电衬底包括捕获凸缘，其具有小于电容器的轴向厚度的高度，并且构造成至少部分地围绕电容器的外围。 捕获凸缘的高度优选为电容器的轴向厚度的四分之三至四分之三。 第一组电容器电极导电地耦合到端子引脚，并且第二组电极板通过设置在电容器的外周和捕获凸缘之间的热定型导电材料与捕获凸缘导电耦合。 提供了一种相关方法，用于制造有利地利用捕获凸缘的EMI滤光器馈通端子组件。

公开(公告)号：US6008980A

公开(公告)日：1999-12-28

申请号：US969480

申请日：1997-11-13

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/35

CPC classification number: H01G4/35 ,  A61N1/3754

Abstract: An integrated hermetically sealed feedthrough capacitor filter assembly is provided for the shielding and decoupling of a conductive terminal pin or lead of the type used, for example, in an implantable medical device such as a cardiac pacemaker or cardioverter defibrillator against passage of external interference signals, such as caused by digital cellular phones. The simplified feedthrough assembly described herein eliminates the traditional terminal pin subassembly. In this novel approach, the ceramic feedthrough capacitor itself forms a hermetic seal with a conductive pacemaker housing to which it is mounted by welding or brazing. The feedthrough capacitor is configured such that its internal electrodes are not exposed to body fluids, with capacitor electrode plate sets coupled respectively to a conductive ferrule, pin or housing (which may be grounded) and to the non-grounded, or active, terminal pin(s) by conductive adhesive, soldering, brazing, welding or the like. In one preferred form, multiple feedthrough filter capacitors are provided in a substantially coplanar array within a common base structure, with each capacitor in association with a respective terminal pin.

Abstract translation: 提供了一种集成的密封的馈通电容器滤波器组件，用于屏蔽和解耦用于例如用于诸如心脏起搏器或心律转复除颤器的可植入医疗装置的类型的导电端子销或引线，以抵抗外部干扰信号的通过， 例如由数字蜂窝电话引起的。 这里描述的简化馈通组件消除了传统的端子销子组件。 在这种新颖的方法中，陶瓷馈通电容器本身与导电起搏器壳体形成气密密封，通过焊接或钎焊将陶瓷馈通电容器安装到壳体上。 馈通电容器被配置为使得其内部电极不暴露于体液，电容器电极板组分别耦合到导电套圈，销或壳体（其可以接地）和非接地或有源的端子引脚 通过导电粘合剂，焊接，钎焊，焊接等。 在一个优选形式中，多个馈通滤波器电容器设置在公共基极结构内的基本上共面的阵列中，每个电容器与相应的端子引脚相关联。

公开(公告)号：US5959829A

公开(公告)日：1999-09-28

申请号：US27115

申请日：1998-02-18

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

IPC: A61N1/375 ,  H03H1/00 ,  H01G4/35

CPC classification number: H03H1/0007 ,  A61N1/3754 ,  A61N1/3718

Abstract: An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors. Additionally, novel chip capacitor geometry/termination-metallization is provided which significantly reduces the internal inductance of the capacitor to improve its high frequency performance as an EMI filter.

Abstract translation: 提供电磁干扰（EMI）滤波电容器组件，用于屏蔽和解耦用于例如在可植入医疗装置中的类型的导电端子引脚或引线，以抵抗外部干扰信号的通过。 EMI滤波器由相对廉价的陶瓷芯片电容器构成，其代替现有技术中发现的相对昂贵的馈通电容器。 芯片电容器直接安装在两个或更多个组合的密封馈通端子上，其在物理尺寸，电介质材料和电容值上变化，使得它们在不同频率下自谐振。 谐振频率的“惊人”和密封端的直接安装为EMI滤波器提供了足够的宽带频率衰减。 在一个优选形式中，多个片式电容器组被安装在公共基座结构上，每个电容器分组与相应的端子引脚相关联。 在另一优选形式中，非导电衬底设置有金属化电路迹线，以更好地适应片式电容器的安装。 另外，提供了新颖的芯片电容器几何/端接金属化，这显着降低了电容器的内部电感，以提高其作为EMI滤波器的高频性能。

公开(公告)号：US5973906A

公开(公告)日：1999-10-26

申请号：US40222

申请日：1998-03-17

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

IPC: A61N1/375 ,  H01G2/22 ,  H01G4/232 ,  H01G4/35 ,  H03H1/00

CPC classification number: H01G4/232 ,  A61N1/3754 ,  H01G2/22 ,  H01G4/35 ,  H03H1/0007

Abstract: An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors. Additionally, novel chip capacitor geometry/termination-metallization is provided which significantly reduces the internal inductance of the capacitor to improve its high frequency performance as an EMI filter. Such reduced inductance chip capacitor designs are readily adaptable to incorporate multiple electrically isolated active plate sets within a single monolithic casing.

Abstract translation: 提供电磁干扰（EMI）滤波电容器组件，用于屏蔽和解耦用于例如在可植入医疗装置中的类型的导电端子引脚或引线，以抵抗外部干扰信号的通过。 EMI滤波器由相对廉价的陶瓷芯片电容器构成，其代替现有技术中发现的相对昂贵的馈通电容器。 芯片电容器直接安装在两个或更多个组合的密封馈通端子上，其在物理尺寸，电介质材料和电容值上变化，使得它们在不同频率下自谐振。 谐振频率的“惊人”和密封端的直接安装为EMI滤波器提供了足够的宽带频率衰减。 在一个优选形式中，多个片式电容器组被安装在公共基座结构上，每个电容器分组与相应的端子引脚相关联。 在另一优选形式中，非导电衬底设置有金属化电路迹线，以更好地适应片式电容器的安装。 另外，提供了新颖的芯片电容器几何/端接金属化，这显着降低了电容器的内部电感，以提高其作为EMI滤波器的高频性能。 这种减小的电感芯片电容器设计容易适用于在单个整体式壳体内并入多个电隔离的有源板组。