Method and apparatus for electronics board retention during manufacturing operations
    1.
    发明授权
    Method and apparatus for electronics board retention during manufacturing operations 有权
    制造过程中电子板保持的方法和装置

    公开(公告)号:US06635308B1

    公开(公告)日:2003-10-21

    申请号:US09644344

    申请日:2000-08-22

    Abstract: This abstract is being provided in accordance with the provisions of Section 1.72 of the Rules of Practice in Patent and Trademark Cases (37 CFR). The applicant intends that this abstract be used only to aid in determining the general nature of the technical disclosure. The applicant does not intend that this abstract be looked to in order to aid or assist in the determination of the scope of any claim. An electronics board (150) is retained by an arrangement of support members (120) or support pins (620) during manufacturing operations conducted on the electronics board (150). The arrangement corresponds to the locations on the electronics board where support members (120) can be placed without interfering with components mounted to the electronics board (150). This information is used to form a transparent template (110, 610) which is placed atop a metallic support plate (100). In one embodiment of the invention, support members (120) include a magnetic base which is inserted through the perforations of the support plate (100, 500). Vacuum driven chucks (200) are placed on the template (110) order to restrict the movement of the electronics board (150) during the application of solder paste to the electronics board (150). In another embodiment, a template (610) is used to determine locations for support pins on a support plate (500) which includes a two-dimensional grid pattern of holes.

    Abstract translation: 该摘要按照“专利商标实务细则”(37 CFR)第1.72条的规定提供。 申请人打算将此摘要用于帮助确定技术披露的一般性质。 申请人不打算为了帮助或协助确定任何权利要求的范围而寻求该摘要。电子板(150)由支撑构件(120)或支撑销(620)的布置保持, 在电子板(150)上进行的制造操作期间。 该布置对应于电子板上的可以放置支撑构件(120)而不干扰安装到电子板(150)的组件的位置。 该信息用于形成放置在金属支撑板(100)上方的透明模板(110,610)。 在本发明的一个实施例中,支撑构件(120)包括通过支撑板(100,500)的穿孔插入的磁性基座。 将真空驱动的卡盘(200)放置在模板(110)上以限制在将焊膏施加到电子板(150)期间电子板(150)的移动。 在另一个实施例中,使用模板(610)来确定支撑板(500)上的支撑销的位置,所述支撑板包括孔的二维网格图案。

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